Probe cards for probing highly-scaled integrated circuits are provided. A probe card includes a backplane and an array of probes extending from the backplane. Each of the probes includes a cantilever member and a probe tip. A first end of the cantilever member is coupled to the backplane, such that the cantilever member extends from the backplane. The probe tip extends from a second end of the cantilever member. The probes are fabricated from semiconductor materials. Each probe is configured to transmit electrical signals between the backplane and a device under test (DUT), via corresponding electrodes of the DUT. The probes are highly-scaled such that the feature size and pitch of the probes matches the highly-scaled feature size and pitch of the DUT's electrodes. The probes comprise atomic force microscopy (AFM) probes that are enhanced for increased electrical conductivity, elasticity, lifetime, and reliability.

Probe cards for probing highly-scaled integrated circuits are provided. A probe card includes a backplane and an array of probes extending from the backplane. Each of the probes includes a cantilever member and a probe tip. A first end of the cantilever member is coupled to the backplane, such that the cantilever member extends from the backplane. The probe tip extends from a second end of the cantilever member. The probes are fabricated from semiconductor materials. Each probe is configured to transmit electrical signals between the backplane and a device under test (DUT), via corresponding electrodes of the DUT. The probes are highly-scaled such that the feature size and pitch of the probes matches the highly-scaled feature size and pitch of the DUT's electrodes. The probes comprise atomic force microscopy (AFM) probes that are enhanced for increased electrical conductivity, elasticity, lifetime, and reliability.

Methods, systems, and devices are disclosed for performing mechanosynthesis, including those that involve bulk chemical preparation of tips, multiple tips for supplying feedstock, and use of sequential tips such as in a thermodynamic cascade; such features may simplify starting requirements, increase versatility, and/or reduce complexity in the mechanosynthesis equipment and/or process.

Methods, systems, and devices are disclosed for performing mechanosynthesis, including those that involve bulk chemical preparation of tips, multiple tips for supplying feedstock, and use of sequential tips such as in a thermodynamic cascade; such features may simplify starting requirements, increase versatility, and/or reduce complexity in the mechanosynthesis equipment and/or process.

A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.

A sensing probe may be formed of a diamond material comprising one or more spin defects that are configured to emit fluorescent light and are located no more than 50 nm from a sensing surface of the sensing probe. The sensing probe may include an optical outcoupling structure formed by the diamond material and configured to optically guide the fluorescent light toward an output end of the optical outcoupling structure. An optical detector may detect the fluorescent light that is emitted from the spin defects and that exits through the output end of the optical outcoupling structure after being optically guided therethrough. A mounting system may hold the sensing probe and control a distance between the sensing surface of the sensing probe and a surface of a sample while permitting relative motion between the sensing surface and the sample surface.

A sensing probe may be formed of a diamond material comprising one or more spin defects that are configured to emit fluorescent light and are located no more than 50 nm from a sensing surface of the sensing probe. The sensing probe may include an optical outcoupling structure formed by the diamond material and configured to optically guide the fluorescent light toward an output end of the optical outcoupling structure. An optical detector may detect the fluorescent light that is emitted from the spin defects and that exits through the output end of the optical outcoupling structure after being optically guided therethrough. A mounting system may hold the sensing probe and control a distance between the sensing surface of the sensing probe and a surface of a sample while permitting relative motion between the sensing surface and the sample surface.

A method of manufacturing, characterizing, mounting, and a system of a probe may include a pillar having a taper angle and at least one engineered defect. The taper angle may be formed using crystallographic- or etching-based techniques. The probe may be mounted to an AFM chip. Furthermore, an RF waveguide may be connected to the AFM chip for providing RF excitation.

A method of manufacturing, characterizing, mounting, and a system of a probe may include a pillar having a taper angle and at least one engineered defect. The taper angle may be formed using crystallographic- or etching-based techniques. The probe may be mounted to an AFM chip. Furthermore, an RF waveguide may be connected to the AFM chip for providing RF excitation.

Articles and methods related to scanning probe microscopy probes are generally provided. A scanning probe microscopy probe may comprise a chip, a mechanical resonator attached to the chip, a tip attached to the mechanical resonator, and a handle attached to the chip. The handle may have a length of at least 5 mm and an average thickness of less than or equal to 500 microns. The probe may further comprise an insulating coating covering both the chip and the handle.