A method for automatically cleaning a probe card includes the following operations. A first wafer is tested in a chamber of a testing machine. A yield of the first wafer is monitored by a tool online monitor system (TOMS). An instruction file is transmitted by the TOMS to a tester, in which the instruction file compiles a first program code of the TOMS into a second program code of the tester. The second program code of the tester is received by the tester. A general purpose interface bus (GPIB) command is transferred to a testing machine by the tester. A cleaning operation is performed by the testing machine.

Embodiments of the present disclosure provide a method and apparatus for displaying measurement parameters. The method comprises: in response to receiving an input signal indicating to display one or more measurement parameters of an electrical device, reading from a memory a first data associated with the one or more measurement parameters for display, and generating an update request for the first data; sending the update request to the electrical device; and in response to receiving, from the electrical device, a second data associated with the one or more measurement parameters, writing the second data to the memory as updated data to replace the first data. According to embodiments of the present disclosure, a large amount of measurement data of a power distribution system can be collected and displayed, data display is decoupled from data communication, and the impact of communication delay is eliminated, thereby improving the user's experience.

A choke is used to carry out high-voltage tests. The choke includes: a housing; a coil arranged in an interior of the housing; at least one electrically conductive component arranged between the coil and the housing; and a flux guide configured to guide a magnetic flux that is configured to be generated by the coil. The flux guide includes a ferromagnetic material; and is arranged between the coil and the at least one electrically conductive component in such a way that the magnetic flux that is configured to be generated by the coil is guided past the electrically conductive component.

A choke is used to carry out high-voltage tests. The choke includes: a housing; a coil arranged in an interior of the housing; at least one electrically conductive component arranged between the coil and the housing; and a flux guide configured to guide a magnetic flux that is configured to be generated by the coil. The flux guide includes a ferromagnetic material; and is arranged between the coil and the at least one electrically conductive component in such a way that the magnetic flux that is configured to be generated by the coil is guided past the electrically conductive component.

A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.

A method for automatically creating installation-specific measuring profiles for an insulation monitoring system, includes: assisting in a computer-controlled manner by means of an assist system via guided instructions for acquiring installation data; and executing the instructions by means of one more sensor devices. The method further includes pre-selecting, assisting, recording, evaluating, detecting, and optimizing steps.

Various embodiments of the teachings herein include an apparatus for measuring a magnetic field of a conductor of an electric current. The apparatus may include three magnetic field sensors arranged on a circumference of a non-circular ellipse. The three magnetic field sensors are arranged equidistantly along the circumference of the ellipse. The magnetic field is measured without using a flux concentrator.

Various embodiments of the teachings herein include an apparatus for measuring a magnetic field of a conductor of an electric current. The apparatus may include three magnetic field sensors arranged on a circumference of a non-circular ellipse defined by parallel projection or orthogonal projection of a circle. Three first positions are arranged equidistantly on a circumference of the circle. The three first positions emerge from the parallel projection or the orthogonal projection onto at least three second positions on the ellipse. The three magnetic field sensors are arranged at the three second positions. The magnetic field is measured without using a flux concentrator.

Embodiments of the present disclosure provide a test system, a test method, and a test board for a charging device. The test board includes: a connecting circuit, configured to be connected to a charging device and a load module respectively, to form a test loop between the charging device and the load module through the connecting circuit; a first communication module, configured to communicate with an upper computer; a second communication module, configured to communicate with the charging device; and a control module, connected to the first communication module and the second communication module respectively, and configured to receive command information sent by the upper computer through the first communication module, and generate a test command according to the command information, to cause the test board or the charging device to execute the test command.

The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.