A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

A probe unit and a holder of a measurement apparatus that can be releasably connected to one another, particularly without tools, are disclosed. The probe unit includes a mounting device having a contact surface and the holder comprises a counter-contact surface assigned to the contact surface. The contact surface can be divided into multiple separate surface sections that respectively abut along a line or two-dimensionally against the assigned counter-contact surface, if the mounting device takes a contact position. The holding force is produced by at least one mounting magnet of the mounting device and/or at least one holding magnet of the holder. Thereby a magnetic axial force in an axial direction as well as a magnetic circumferential force in a circumferential direction around the axial direction is created, so that the mounting device and holder are urged relative to one another in a desired rotational position in the circumferential direction.

A probe unit and a holder of a measurement apparatus that can be releasably connected to one another, particularly without tools, are disclosed. The probe unit includes a mounting device having a contact surface and the holder comprises a counter-contact surface assigned to the contact surface. The contact surface can be divided into multiple separate surface sections that respectively abut along a line or two-dimensionally against the assigned counter-contact surface, if the mounting device takes a contact position. The holding force is produced by at least one mounting magnet of the mounting device and/or at least one holding magnet of the holder. Thereby a magnetic axial force in an axial direction as well as a magnetic circumferential force in a circumferential direction around the axial direction is created, so that the mounting device and holder are urged relative to one another in a desired rotational position in the circumferential direction.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

A current sensor detects a current flowing through a current path. The current sensor includes plural sensor elements, and each sensor element has a current path, a magnetic detector, a first magnetic shield and a second magnetic shield. The magnetic detector faces a part of the current path. A part of the current path and the magnetic detector are positioned between the first and second magnetic shields. The second magnetic field, the current path, the magnetic detector and the first magnetic shield are stacked in order along a stacking direction in each sensor element. The plural sensor elements are disposed adjacently to each other in a direction perpendicular to the stacking direction. The current path has a facing part facing the magnetic detector, and a first bent part bending from the facing part toward the second magnetic shield.

A current sensor detects a current flowing through a current path. The current sensor includes plural sensor elements, and each sensor element has a current path, a magnetic detector, a first magnetic shield and a second magnetic shield. The magnetic detector faces a part of the current path. A part of the current path and the magnetic detector are positioned between the first and second magnetic shields. The second magnetic field, the current path, the magnetic detector and the first magnetic shield are stacked in order along a stacking direction in each sensor element. The plural sensor elements are disposed adjacently to each other in a direction perpendicular to the stacking direction. The current path has a facing part facing the magnetic detector, and a first bent part bending from the facing part toward the second magnetic shield.

It is described an electrical installation measuring system comprising a control and measuring device configured to be installed on an electrical panel of an electrical installation and perform at least one measure of an electrical parameter of the electrical installation depending on an electrical load connected to the electrical installation and transmit command signals along a telecommunication link. The system further comprises a variable load device connectable to the electrical installation and configured to: receive the command signals from the telecommunication link; and assume a plurality of load configurations according to the command signals.