A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A method and apparatus are for monitoring a secondary power device and for accurately checking a state of the secondary power device, and an electronic system includes the apparatus. The method of monitoring a secondary power device includes setting a first reference parameter by using a voltage of at least one capacitor of the secondary power device, setting a second reference parameter by using the voltage of the at least one capacitor and the first reference parameter, and setting a reference level for checking of the state of the secondary power device by using the second reference parameter, wherein the reference level is used in checking of the state of the secondary power device.

A method and apparatus are for monitoring a secondary power device and for accurately checking a state of the secondary power device, and an electronic system includes the apparatus. The method of monitoring a secondary power device includes setting a first reference parameter by using a voltage of at least one capacitor of the secondary power device, setting a second reference parameter by using the voltage of the at least one capacitor and the first reference parameter, and setting a reference level for checking of the state of the secondary power device by using the second reference parameter, wherein the reference level is used in checking of the state of the secondary power device.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

A method for emulating an electromagnetic environment, EME, in an anechoic chamber comprises the steps of: receiving, by a first receiving unit, an input signal outside the anechoic chamber; generating, by a signal generating unit, an emulated signal based on the input signal; transmitting, by a transmitting unit, the emulated signal inside the anechoic chamber to emulate the EME; receiving, by a second receiving unit, the emulated signal inside the anechoic chamber; and adjusting, by the signal generating unit, the emulated signal generated by the signal generating unit based on the emulated signal received by the second receiving unit.

A linear voltage regulator with isolated supply current is disclosed. The voltage regulator is configured and controlled such that its output current closely matches its input current (any quiescent current consumed by the regulator is negligible relative to the amount of current passed by the regulator). In certain implementations, the voltage regulator is implemented as an analog component. In other implementations, the voltage regulator includes or cooperates with digital elements, such as an analog-to-digital converter, a digital processing core, or a digital-to-analog converter.

A linear voltage regulator with isolated supply current is disclosed. The voltage regulator is configured and controlled such that its output current closely matches its input current (any quiescent current consumed by the regulator is negligible relative to the amount of current passed by the regulator). In certain implementations, the voltage regulator is implemented as an analog component. In other implementations, the voltage regulator includes or cooperates with digital elements, such as an analog-to-digital converter, a digital processing core, or a digital-to-analog converter.