Patent classifications
G01R31/2646
Slave BMS inspection system and method
A master battery management system (BMS) used for a battery system in which a plurality of slave BMSs and the master BMS communicate wirelessly includes: a receiving unit configured to receive, from each slave BMS, data of the corresponding slave BMS and data transmission information of at least one other slave BMS except for the corresponding slave BMS among the plurality of slave BMS during one period in which each of the plurality of slave BMSs transmits data at least once; and a determination unit configured to determine a communication error or an abnormal slave BMS by using the data of the corresponding slave BMS and the at least one other slave BMS data received from each slave BMS during one period. The data transmission information of the at least one other slave BMS is information on a history that the other slave BMS transmits data.
System and method for semiconductor device random telegraph sequence noise testing
A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.
Device testing and monitoring method thereof
Some embodiments of the present disclosure provide a method including turning on a noise-measuring system for a device under test (DUT) with the DUT turned off; measuring a first phase noise caused by the noise-measuring system; turning on the DUT; measuring a second phase noise caused by the noise-measuring system and the DUT; and subtracting the first phase noise from the second phase noise to obtain a third phase noise caused by the DUT.
TESTING SYSTEM, DEVICE OF A DATA COLLECTING CHIP AND CONTROL METHOD THEREOF
A testing device of a data collecting chip (10) and control method thereof, and the testing device (10) includes: a data collecting module (200) for receiving multiple frames of sampling data sampling data collected by the data collecting chip; a storing module (300); a processing module (400) for calculating noise of a plurality of data sampling points to obtain a noise test result; a data transceiving module (500) for uploading the noise test result; and a control module (600). The testing device (10) only uploads the noise test result by calculating the noise of the plurality of data sampling points, so that the efficiency of a chip test is improved, the cost of the chip test is reduced, and the test reliability is ensured better.
Slave BMS Inspection System and Method
A master battery management system (BMS) used for a battery system in which a plurality of slave BMSs and the master BMS communicate wirelessly includes: a receiving unit configured to receive, from each slave BMS, data of the corresponding slave BMS and data transmission information of at least one other slave BMS except for the corresponding slave BMS among the plurality of slave BMS during one period in which each of the plurality of slave BMSs transmits data at least once; and a determination unit configured to determine a communication error or an abnormal slave BMS by using the data of the corresponding slave BMS and the at least one other slave BMS data received from each slave BMS during one period. The data transmission information of the at least one other slave BMS is information on a history that the other slave BMS transmits data.
Fast convergence method for cross-correlation based modulation quality measurements
Techniques are disclosed related to determining a modulation quality measurement of a device-under-test (DUT). A modulated signal is received from a source a plurality of times, and each received modulated signal is transmitted to each of a first vector signal analyzer (VSA) and a second VSA. The first VSA and the second VSA demodulate the received modulated signals to produce first error vectors and second error vectors, respectively. A cross-correlation calculation is performed on the first error vectors and second error vectors of respective received modulated signals to produce a complex-valued cross-correlation measurement, and a real component of the cross-correlation measurement is averaged over the plurality of received modulated signals. A modulation quality measurement is determined based on the averaged cross-correlation measurement.
SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE RANDOM TELEGRAPH SEQUENCE NOISE TESTING
A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.
Fast Convergence Method for Cross-Correlation Based Modulation Quality Measurements
Techniques are disclosed related to determining a modulation quality measurement of a device-under-test (DUT). A modulated signal is received from a source a plurality of times, and each received modulated signal is transmitted to each of a first vector signal analyzer (VSA) and a second VSA. The first VSA and the second VSA demodulate the received modulated signals to produce first error vectors and second error vectors, respectively. A cross-correlation calculation is performed on the first error vectors and second error vectors of respective received modulated signals to produce a complex-valued cross-correlation measurement, and a real component of the cross-correlation measurement is averaged over the plurality of received modulated signals. A modulation quality measurement is determined based on the averaged cross-correlation measurement.
Slave BMS Inspection System and Method
A master battery management system (BMS) used for a battery system in which a plurality of slave BMSs and the master BMS communicate wirelessly includes: a receiving unit configured to receive, from each slave BMS, data of the corresponding slave BMS and data transmission information of at least one other slave BMS except for the corresponding slave BMS among the plurality of slave BMS during one period in which each of the plurality of slave BMSs transmits data at least once; and a determination unit configured to determine a communication error or an abnormal slave BMS by using the data of the corresponding slave BMS and the at least one other slave BMS data received from each slave BMS during one period. The data transmission information of the at least one other slave BMS is information on a history that the other slave BMS transmits data.
DEVICES AND METHODS FOR NOISE TESTING OF A SUBSTRATE INCLUDING THROUGH SILICON VIAS
Embodiments of the present disclosure provide a device and a method for noise testing of a substrate including through silicon vias (TSVs). The device may include a substrate including first TSVs; an excitation link including at least two groups of second TSVs; an insulation layer arranged between the excitation link and the substrate; and a testing link including at least one group of third TSVs, the testing link being electrically connected with the substrate.