A method for testing printed circuit boards (20) in a test apparatus having a carrying apparatus for the printed circuit board (20) and having test modules for measuring physical variables of components (EB) and contact points (29) on the printed circuit board (20), in which the width of the printed circuit board (20) defines an X direction, its length defines a Y direction and its thickness defines a Z direction inside the test apparatus, reference points, the X, Y and Z positions of which relative to the carrying apparatus are known, are present on the printed circuit board (20) or outside the latter, the X and Y positions of the components (EB) and contact points (29) relative to the reference points are known, the measurement of the physical variables depends on an actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured, and the actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured is determined by means of an interpolation method starting from the X, Y and Z positions of selected reference points.

The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze the DUT based on the acquired image.

A testing device for testing an electronic device includes a base, a testing mechanism, a pushing mechanism, and a fastening mechanism. The testing mechanism is rotatably fastened to the base and can be rotated from a first position to a second position. The fastening mechanism is mounted on the base. The pushing mechanism is rotatably mounted on the testing mechanism. When the testing mechanism is rotated from the first position to the second position, the pushing mechanism is rotated and pushes against the testing mechanism. The testing mechanism is connected to an electronic device. The testing mechanism is positioned in the second position via the fastening mechanism.

The present disclosure provides a test device and a test method using the test device. The test device includes a first fastener structure for fastening a to-be-tested substrate with first touch lines, a second fastener structure for fastening a test match panel with second touch lines, and the first touch lines and the second touch lines forming a touch module, a third fastener structure for supporting a change-over flexible printed circuit board, a signal input structure for electrically connecting to one of a circuit board in the test match panel and the first touch lines through the change-over flexible printed circuit board, and inputting trigger data signals, a sensing signal capture structure for capturing touch sensing signals in the first touch line or the second touch lines.

Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

A signal testing device and a signal testing method are provided. The method includes: obtaining, through a probe, a first frequency response corresponding to a test fixture and a device under test (DUT); obtaining, through the probe, a second frequency response corresponding to the test fixture; and generating a frequency response corresponding to the DUT according to the first frequency response, the second frequency response, a de-embedding algorithm, and an empirical mode decomposition algorithm.

An information processing apparatus includes a processor configured to: obtain failure information to identify details of a failure which has occurred in a target device on which failure analysis is to be performed; and superimpose and display information related to a part or a wire on a captured image of a printed circuit board included in the target device, the part or the wire being a possible cause for the failure identified by the failure information from multiple parts and wires disposed on the printed circuit board.

An inspecting device of a display panel includes a contact including first probe pins that contact to data pads of a display panel and second probe pins that contact to common voltage pads of the display panel, a signal generator coupled to the first probe pins, the signal generator configured to generate a first data voltage corresponding to a first gray level and a second data voltage corresponding to a second gray level, a power generator coupled to the second probe pins, the power generator configured to generate a first common voltage and a second common voltage of which a voltage level is different from a voltage level of the second common voltage, and a defect detector configured to detect a defect of the display panel by removing a contact noise generated due to contact failure of the first probe pins and the second probe pins.

A method for electrical testing of an electrical circuit for defects, all electrical or electronic parts are measured simultaneously, so an electrical image of the electrical circuit is received by a control/evaluation unit, in which an electrical excitation signal of an electrical current or an electrical voltage is applied simultaneously by the control/evaluation unit and a plurality of driver circuits at a plurality of test points of the electrical circuit, which test points may be arranged in any way. The electrical excitation signals applied via the driver circuits differ with regard to their spectral characteristic. The electrical current flowing in the particular test point and the resultant electrical voltage are recorded synchronously with regard to a waveform in relation to an electrical ground potential, and subsequently parameters of the parts and their electrical connections are calculated by the control/evaluation unit.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.