A flexible monitoring system and corresponding methods of use are provided. The system can include a base containing backplane, and one or more monitoring circuits. The monitoring circuits can be designed with a common architecture that is programmable to perform different predetermined functions. As a result, monitoring circuits can be shared between different implementations of the flexible monitoring system. Multiple bases that can be communicatively coupled in a manner that establishes a common backplane between respective bases that is formed from the individual backplanes of each base. Each monitoring circuit is not limited to sending data to and/or receiving data from the backplane to which it is physically coupled but can instead can communicate along the common backplane. Computational processing capacity can be increased or decreased independently of input signals received by addition or removal of processing circuits from the monitoring system.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

A self-test system for PCIe and a method thereof are disclosed. In the system, a first circuit interconnect card and a second circuit interconnect card are inserted into CEM slots, respectively, and the first circuit interconnect card and the second circuit interconnect card are electrically connected to each other through a FFC, the central processing unit generates and provides differential signals to the first circuit interconnect card and the second circuit interconnect card; the first circuit interconnect card or the second circuit interconnect card provide differential signals to the second circuit interconnect card or the first circuit interconnect card through the first FFC interface and the second FFC interface, respectively, and the second circuit interconnect card or the first circuit interconnect card provides the differential signals to a central processing unit, so as to implement self-check for PCIe.

An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

One aspect of this description relates to a testing apparatus including an advance process control monitor (APCM) in a first wafer, a plurality of pads disposed over and coupled to the APCM. The plurality of pads are in a second wafer. The testing apparatus includes a testing unit disposed between the first wafer and the second wafer. The testing unit is coupled to the APCM. The testing unit includes a metal structure within a dielectric. The testing apparatus includes a plurality of through silicon vias (TSVs) extending in a first direction from the first wafer, through the dielectric of the testing unit, to the second wafer.

A rigid-flex printed circuit board (PCB) includes at least one rigid PCB including at least one electrical component, a flex circuit, and a built-in diagnostic circuit. The flex circuit includes at least one end connected to the at least one rigid PCD. The flex circuit includes at least one signal trace configured to deliver an electrical signal to the at least one electrical component. The built-in diagnostic circuit is configured to detect a fault in the rigid-flex PCB.

Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.

A portable nodal impedance analyser. The impedance analyser (100) is configured with an auto best curve-fit application which automatically selects the values for Voltage, Source Impedance and Frequency of the stimulus waveform (best fit values) to generate equivalent circuit and its appropriate V-I traces. The auto best curve-fit application automatically selects one or more input Sinusoidal Patterns (Waveforms) in such a way that the V-I Characteristics of the components present in a Node (the two points across which the input Pattern is driven, and response is received), are best revealed by automatically adjusting the Drive Voltage (0.2V, 4V, 8V and 13V), Source Impedance (10Ω, 50Ω, 100Ω, 500Ω, 1KΩ, 5KΩ, 10KΩ, 50KΩ, 100KΩ) and Frequency (from 1 Hz to 50 KHz) of the input Patterns.

A method for monitoring defects of a product implemented in an electronic device obtains product data in real time and determines whether a product is defective based on the product data; when the product is defective, outputting first warning information based on the number of defects of the product which satisfy a first preset condition; obtaining a rate of defects of the product every first preset time period, and outputting second warning information based on the rate of defects of the product when the rate of defects satisfies at least one of a second, third, and fourth preset conditions; when any warning information is output, analyzing distribution of the defects of the product; and predicting at least one cause of each defect of the product according to historical maintenance data of the product and a self-learning record of the electronic device.

Embodiments described herein provide an anisotropic conductive film (ACF) positioned on a semiconductor package and techniques of using the ACF to test semiconductor devices positioned in or on the semiconductor package. In one example, a semiconductor package comprises: a die stack comprising one or more dies; a molding compound encapsulating the die stack; a substrate on the molding compound; a contact pad on a surface of the substrate and coupled to the die stack; a test pad on the surface of the substrate; a conductive path between the contact pad and the test pad, where an electrical break is positioned along the conductive path; and an ACF over the electrical break. Compressing the ACF by a test pin creates an electrical path that replaces the electrical break. Data can be acquired by test pin and provided to a test apparatus, which determines whether the dies in the die stack are operating properly.