An apparatus and a method for inspecting a semiconductor includes a water tank which includes a housing, an interior of which is filled with a liquid, and a support block which provides a settling surface for an inspection object inside the housing. A plurality of signal generators are installed on a bottom surface of the housing, and output a frequency signal in a direction in which the inspection object is located. A power supply operates the signal generators. A probe is placed above the inspection object, and a receiver which operates with the probe and is attached to a bottom surface of the support block. Foreign matter remaining on the inspection object are removed, using a plurality of frequency signals which are output by the plurality of signal generating units.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

The present disclosure relates to a compact antenna test range (CATR) system. The CATR system comprises a measurement chamber, at least one feed antenna which is configured to transmit a radio frequency, RF, signal, at least one reflector which is arranged to reflect the RF signal towards a measurement area in the measurement chamber, and at least two preferably metallic calibration surfaces which can be arranged at two or more positions in the measurement area, wherein the calibration surfaces are configured to reflect a respective reflection of the RF signal back to the at least one reflector which is, in turn, configured to reflect the reflections of the RF signal back to the at least one feed antenna. The CATR system further comprises a measurement unit which is configured to receive the respective reflections of the RF signal and to determine and/or visualize a time difference between the reception of the respective reflections of the RF signal.

Herein disclosed are a wafer, a wafer testing system, and a method thereof. Said wafer testing method comprises the following steps. First, an incident light is provided toward a wafer. And, a wafer surface image corresponded to the wafer is generated. Then, determining whether the wafer surface image has a plurality of first strips and a plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical. When the wafer surface image has the plurality of first strips and the plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical, a qualified signal corresponded to the wafer is provided.

Herein disclosed are a wafer, a wafer testing system, and a method thereof. Said wafer testing method comprises the following steps. First, an incident light is provided toward a wafer. And, a wafer surface image corresponded to the wafer is generated. Then, determining whether the wafer surface image has a plurality of first strips and a plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical. When the wafer surface image has the plurality of first strips and the plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical, a qualified signal corresponded to the wafer is provided.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

A test and measurement instrument includes one or more ports including at least one test port configured to couple to one or more devices under test, a user interface to receive one or more user inputs, an acquisition memory to store waveform data acquired from the one or more devices under test, one or more processors configured to execute code that causes the one or more processors to: receive an input through the user interface; determine one or more requested data types based on the input; transform the waveform data into compressed data containing only data elements corresponding to the one or more requested data types; and transmit the compressed data to a client. A method of providing usage-aware compressed data from a test and measurement instrument includes acquiring waveform data from one or more devices under test, receiving a user input through a user interface, determining one or more requested data types based on the user input, transforming the waveform data into compressed data containing only data elements corresponding to the one or more requested data types, and transmitting the compressed data to a client.