Patent classifications
G01R31/31724
SELF-CONTAINED BUILT-IN SELF-TEST CIRCUIT WITH PHASE-SHIFTING ABILITIES FOR HIGH-SPEED RECEIVERS
Aspects of the invention include a phase rotator, that is located at a built-in self-test (BIST) path of a receiver, receiving a clock signal from an on-chip clock. The phase rotator shifts the phases of the clock signal. The phase rotator transmits the shifted clock signal to a binary sequence generator, that is located at the receiver. The binary sequence generator outputs a binary sequence, where the binary sequence generator is driven by the shifted clock signal.
INTEGRATED CIRCUIT AND AN ELECTRONIC DEVICE INCLUDING INTEGRATED CIRCUIT
An integrated circuit and an electronic device including the integrated circuit are provided. An integrated circuit includes a sequential logic circuit, which includes a first scan cell that is configured to receive a scan input, and a plurality of scan cells sequentially connected in series from the first scan cell, a control unit, which is configured to receive a selection signal including an output of each of the plurality of scan cells, and is further configured to output a control signal responsive to the selection signal, and a monitoring circuit, which is configured to receive the control signal, is configured to perform first monitoring of first data at a first node that is an observation node in the sequential logic circuit responsive to the control signal, and is configured to output a result of the first monitoring to a monitoring node.
Wearout card use count
Examples described herein provide a wearout card and a method for using the wearout card. The wearout card generally includes a first set of connectors configured to connect the testing apparatus to a testing controller, and a second set of connectors configured to connect the testing apparatus to a device under test (DUT). The wearout card can also include a memory configured to store identifying information of the testing apparatus and a use counter indicating a number of times different DUTs have been connected to the second set of connectors.
Fault injection in a clock monitor unit
A self-test mechanism within an integrated circuit to test for faulty operation of a clock monitor unit implemented within the integrated circuit for monitoring a clock signal. The mechanism intentionally injects faults into the clock monitor unit to evaluate if the clock monitor unit is operating in accordance with its specified operating parameters. The injected faults are intended to cause the clock monitor unit to determine that the clock signal is operating outside of an artificially generated, imaginary specified frequency range. If the injected faults do not cause the clock monitor unit to determine that the clock signal is operating both above and below the artificially generated, imaginary specified frequency range, then the clock monitor unit is not functioning according to specified operating parameters.
SYSTEM FOR TESTING AN ELECTRONIC CIRCUIT AND CORRESPONDING METHOD AND COMPUTER PROGRAM PRODUCT
A system, method, and device to test an electronic circuit are disclosed having a stage to supply a driving signal to a load comprising a pull-up switch and a pull-down switch and a pre-driver stage including pre-driver circuits. The electronic circuit including circuits for testing the pre-driver stage under the control of an automatic testing equipment (ATE) to operate a built-in self-test sequence including test commands for the pre-driver stage under the control of an external test signal issued by the ATE. The system includes a time measuring circuit to measure duration of signals at the output of the stage coupled to a pass-fail check circuit, and to evaluate if the duration of signals at the output of the stage to determine whether the output satisfies a pass criterion.
INTERLEAVED TESTING OF DIGITAL AND ANALOG SUBSYSTEMS WITH ON-CHIP TESTING INTERFACE
The disclosure provides a method and apparatus of interleaved on-chip testing. The method merges a test setup for analog components with a test setup for digital components and then interleaves the execution of the digital components with the analog components. This provides concurrency via a unified mode of operation. The apparatus includes a system-on-chip test access port (SoC TAP) in communication with a memory test access port (MTAP). A built-in self-test (BIST) controller communicates with the MTAP, a physical layer, and a memory. A multiplexer is in communication with the memory and a phase locked loop (PLL) through an AND gate.
BUILT IN SELF TEST (BIST) FOR CLOCK GENERATION CIRCUITRY
Testing clock division circuitry includes generating pseudo random test pattern bits for scan chain logic in programmable clock division logic circuitry and divided clock counter circuitry. A shift clock is used to shift the test pattern bits into the scan chain logic. A capture clock signal is used in the programmable clock division logic during a non-test mode of operation. The shift clock is used to provide output shift bits from the scan chain logic to a multi-input shift register (MISR). Once all the output shift bits for the test pattern bits are provided to the MISR, a final test signature from the MISR is compared to an expected test signature to determine whether the programmable clock division logic circuitry and divided clock counter circuitry are free of faults.
SYSTEM AND METHOD FOR FACILITATING BUILT-IN SELF-TEST OF SYSTEM-ON-CHIPS
A control system, that includes a primary controller and various auxiliary controllers, is configured to facilitate a built-in self-test (BIST) of a system-on-chip (SoC). The primary controller is configured to initiate a BIST sequence associated with the SoC. Based on the BIST sequence initiation, each auxiliary controller is configured to schedule execution of various self-test operations on various functional circuits, various memories, and various logic circuits of the SoC by various functional BIST controllers, various memory BIST controllers, and various logic BIST controllers of the SoC, respectively. Based on the execution of the self-test operations, each auxiliary controller further generates various status bits with each status bit indicating whether at least one functional circuit, at least one memory, or at least one logic circuit is faulty. Based on the status bits generated by each auxiliary controller, a fault diagnosis of the SoC is initiated.
Controller structural testing with automated test vectors
A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.
Library cell modeling for transistor-level test pattern generation
This application discloses a computing system implementing an automatic test pattern generation tool to convert a transistor-level model of a library cell describing a digital circuit into a switch-level model of the library cell, generate test patterns configured to enable detection of target defects injected into the switch-level model of the library cell, and bifurcate the test patterns into a first subset of the test patterns and a second set of the test patterns based on detection types for the target defects enabled by the test patterns. The computing system can implement a cell model generation tool to perform an analog simulation of the transistor-level model of the library cell using the second subset of the test patterns to verify that they enable detection of target defects, while skipping performance of the analog simulation of the transistor-level model of the library cell using the first subset of the test patterns.