Some embodiments include an x-ray system, comprising: an x-ray detector comprising: a housing; a sensor array configured to generate an image in response to incident x-ray radiation and disposed in the housing; a control circuit coupled to the sensor array, configured to control the sensor array, and disposed in the housing; and a first connector interface disposed on an exterior of the housing and electrically connected to the control circuit; an adapter comprising: a second connector interface configured to physically and electrically mate with the first connector interface; a third connector interface having at least one of a physical configuration and an electrical configuration different from the first connector interface; and a plurality of electrical connections between the second connector interface and the third connector interface.

Disclosed herein is a method comprising: generating multiple radiation beams respectively from multiple locations toward an object and an image sensor, wherein the image sensor comprises an array of multiple active areas, and gaps among the multiple active areas, and capturing multiple partial images of the object with the image sensor using respectively radiations of the multiple radiation beams that have passed through and interacted with the object, wherein each point of the object is captured in at least one partial image of the multiple partial images.

In one example, there is provided a matrix of detectors configured to be used in a system for inspecting cargo using inspection radiation. The matrix includes a plurality of columns of detector modules, the detector modules of each column extending along a substantially longitudinal direction, each detector module including a surface configured to receive the inspection radiation, and the plurality of columns of detector modules being adjacent to each other in a lateral direction substantially perpendicular to the longitudinal direction and substantially parallel to the surfaces of the detector modules, wherein the plurality of columns of detector modules includes at least two columns of detector modules being offset with respect to each other in an in-depth direction substantially perpendicular to both the lateral direction and the longitudinal direction.

The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.

Disclosed herein is a method for making a radiation detector. The method comprises forming a recess into a substrate and forming a semiconductor single crystal in the recess. The semiconductor single crystal may be a cadmium zinc telluride (CdZnTe) single crystal or a cadmium telluride (CdTe) single crystal. The method further comprises forming electrical contacts on the semi conductor single crystal and bonding the substrate to another substrate comprising an electronic system therein or thereon. The electronic system is connected to the electrical contact of the semiconductor single crystal and configured to process an electrical signal generated by the semiconductor single crystal upon absorption of radiation particles.

The invention relates to a solution for determining events related to photons and charged particles useful in therapies that use methodologies related to hadron therapy. In one aspect of the invention, it relates to a device having a sandwich-type structure of photon-detecting panels (1) and charged particle-detecting panels (2), which can be suitably associated with respective sensors. Also included is a method for detecting photons and charged particles that uses the aforementioned device. Lastly, a specific use of the object of the invention in hadron therapy is described.

For gamma ray detection, 3D tiling is made possible by modules that include a gamma ray detector with at least some electronics extending away from the detector as a side wall, leaving an air or low attenuation gap behind the gamma ray detector. The modules may be stacked to form arrays of any shape in 3D, including stacking to form a Compton detector with a scatter detector separated from the catcher detector by the low attenuation gap where the electronics form at least one side wall between the detectors. The modules may be stacked so that the detectors from the different modules are in different planes and/or not part of a same surface (e.g., same surface provided with just 1D or 2D tiling).

A sensor system includes a detector substrate, multiple readout substrates and a processing substrate. The detector substrate has a detector mounted thereon. Each of the readout substrates is disposed perpendicular to the detector substrate, and has corresponding readout circuitry mounted thereon. The processing substrate is disposed perpendicular to each of the readout substrates and parallel to the detector substrate, and has one or more processing elements mounted thereon. Electrical connections between component nodes on the detector substrate and corresponding readout substrates are made using connectors or right-angled solder joints created using a solder reflow process. Electrical connections between component nodes on the processing substrate and corresponding readout substrates are also made using connectors or right-angled solder joints created using a solder reflow process. The geometric arrangement of the substrates allows for high density of pixelation on the detector. In an embodiment, the sensor system is a radiation detector system.

A radiation detector module of an embodiment includes a radiation detector, a first electrode, a second electrode, and a mark. The radiation detector includes an incident surface and is configured to detect radiation incident from the incident surface. The first electrode is provided on the side of the incident surface of the radiation detector. The second electrode is provided to face the first electrode through the radiation detector. The mark is provided on at least one of the incident surface of the radiation detector and the first electrode.

For gamma ray detection, 3D tiling is made possible by modules that include a gamma ray detector with at least some electronics extending away from the detector as a side wall, leaving an air or low attenuation gap behind the gamma ray detector. The modules may be stacked to form arrays of any shape in 3D, including stacking to form a Compton detector with a scatter detector separated from the catcher detector by the low attenuation gap where the electronics form at least one side wall between the detectors. The modules may be stacked so that the detectors from the different modules are in different planes and/or not part of a same surface (e.g., same surface provided with just 1D or 2D tiling).