A sensing cable includes a first optical fiber, a second optical fiber that extends along the first optical fiber and that is spaced from the first optical fiber, and a transmitting material that includes an intervention portion present between the first optical fiber and the second optical fiber, the transmitting material being configured to transmit light from the first optical fiber to the second optical fiber through the intervention portion.

A method for manufacturing an optical fiber includes: a coating step of forming a first layer by applying a first ultraviolet ray curable resin composition onto a glass fiber, and then, of forming a second layer by applying a second ultraviolet ray curable resin composition onto the first layer; a first irradiation step of curing the first layer and the second layer by irradiating the first layer and the second layer with an ultraviolet ray, and of obtaining the optical fiber including a primary resin layer and a secondary resin layer; and a second irradiation step of irradiating the optical fiber with an ultraviolet ray at an illuminance of less than or equal to one tenth of an illuminance in the first irradiation step for an irradiation time of longer than or equal to 10 times an irradiation time in the first irradiation step.

Disclosed is an optical waveguide, for transmitting a guided optical light beam having a wavelength greater than 180 nm. The waveguide includes a core layer for guiding light made of a first material having a first index of refraction, and a cladding layer made of a thermoplastic elastomer. Also disclosed are: a medical device and also to a waveguide sensor including the optical waveguide of the invention; a method of fabrication of the optical waveguide. The method includes a step of providing a thermoplastic elastomer preform having a central longitudinal aperture for introducing a liquid polymer, before or after reducing and elongating the preform to a predetermined length and lateral dimension. The method includes a polymerizing step of the core of the formed optical waveguide; and use of the optical waveguide in association with a surgical instrument.

A photonic integrated circuit (PIC) includes an organic solid crystal (OSC) material layer, the OSC material layer having a substrate portion and a raised optical element integral with and extending from the substrate portion. The raised optical element may include a passive or active component of the photonic integrated circuit.

A graphene optical device according to an embodiment of the present disclosure includes: an upper semiconductor layer; a lower semiconductor layer; and a graphene capacitor disposed between the upper semiconductor layer and the lower semiconductor layer, wherein the graphene capacitor includes a first graphene, a second graphene, and a first insulation layer disposed between the first graphene and the second graphene, wherein the first graphene and the second graphene partially overlap each other when viewed from the upper semiconductor layer toward the lower semiconductor layer.

Optical modulators, one or more components of various optical modulators, and methods of forming optical modulators and/or one or more components are disclosed. A substrate may be provided and a precursor material may be applied to the substrate with a micro-contact printing stamp. The precursor material may be cured on the substrate and the waveguide may be formed into a micro-ring resonator. The micro-contact printing stamp may be configured to create a waveguide on the substrate.

A monolithic PIC including a monolithic laser formed in/on a platform and a polymer modulator monolithically built onto the platform and optically coupled to the laser. The modulator includes a first cladding layer, a passive core region with a surface abutting a surface of the first cladding layer, the core region extending to define an input and an output for the modulator. A shaped electro-optic polymer active component has a surface abutting a surface of a central portion of the core region. The active component is polled to align dipoles and promote modulation of light and has a length that extends only within a modulation area defined by modulation electrodes. A second cladding layer encloses the active component and is designed to produce adiabatic transition of light waves traveling in the core region into the active component to travel the length thereof and return to the core region.

Fabrication of augmented reality (AR) and mixed reality (MR) polymer eyepiece assemblies and the resulting AR/MR polymer eyepiece assemblies may include one or more features, separately or in any appropriate combination, to compensate for expected deformation and to maintain substantially uniform gaps between polymer layers. Such features include fabricating polymer eyepiece assemblies with components having coefficients of thermal expansion (CTE) that are substantially the same; modifying the surface chemistry or structure of one or more polymer layers to increase hydrophobicity or omniphobicity of the polymer layer; disposing adhesive between adjacent polymer layers in continuous and/or extended configurations; and disposing microspheres of different sizes at selected locations between polymer layers.

Example methods, devices, and systems for optical transmission are disclosed. An example method can comprise coupling a plurality of optical filters to a substrate. The method can comprise coupling a polymeric waveguide to the plurality of optical filters. The polymeric waveguide can be configured to guide a free space optical signal along the polymeric waveguide and communicate, via the plurality of optical filters, one or more components of the free optical space signal to an integrated chip.

A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.