Multidrop optical connections are used for an optical memory module. Multiple buffer integrated circuits on a module each receive information from the host system using different wavelengths of light transmitted on the same waveguide. Multiple buffer integrated circuits each transmit information back to the CPU using different wavelengths of light transmitted on another waveguide. Wavelength resonant ring couplers disposed on the buffer integrated circuits are used to separate the wavelength being received by a particular buffer integrated circuit from the wavelengths of light destined for other buffer integrated circuits on the same waveguide. Wavelength resonant ring modulators also disposed on the buffer integrated circuits modulate specific wavelengths of light unique to each buffer integrated circuit to transmit information to the CPU.

A flexible optical waveguide board and a method of manufacturing the same are provided. The flexible optical waveguide board includes: a flexible substrate, wherein a surface of a side of the flexible substrate is a rough surface; an optical waveguide, disposed on the rough surface of the flexible substrate; a cover layer, disposed on a surface of a side of the optical waveguide away from the flexible substrate. In this way, structural reliability and environmental ageing resistance of the flexible optical waveguide board is improved.

A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.

Provided are three dimensional, stretchable, optical sensor networks that can localize deformations. The devices described herein are suitable for uses in soft robots to determine the position of external contact, such as touching, and possibly internal deformations that may be caused by actuation. Sensor networks of the present disclosure contain a substrate, such as a 3D lattice, and cores having a cladding, such as air. Light passes through the cores and upon deformation of the substrate, cores may come into contact, allowing light to couple between cores due to frustrated total internal reflection. The resulting changes in intensity in the cores can be used to determine the placement and magnitude of deformation.

Provided are three dimensional, stretchable, optical sensor networks that can localize deformations. The devices described herein are suitable for uses in soft robots to determine the position of external contact, such as touching, and possibly internal deformations that may be caused by actuation. Sensor networks of the present disclosure contain a substrate, such as a 3D lattice, and cores having a cladding, such as air. Light passes through the cores and upon deformation of the substrate, cores may come into contact, allowing light to couple between cores due to frustrated total internal reflection. The resulting changes in intensity in the cores can be used to determine the placement and magnitude of deformation.

A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.

A waveguide is provided. The waveguide having a first core, a second core spaced apart from and parallel with the first core, and a cladding surrounding the first core and the second core. An interstitial portion of the cladding is located between the first core and the second core. A first region of the first core adjacent to the cladding or of the cladding adjacent to the first core is color dyed.

A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.−7 to 10.sup.−6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.

A method for producing an optical waveguide by: (a) depositing a first composition: (i) a polysiloxane comprising epoxy and alkenyl groups with refractive index no greater than 1.50, (ii) a compound comprising at least one epoxy group and refractive index no greater than 1.49, and (iii) a polysiloxane having refractive index at least 1.50; (iv) a photo acid generator; (v) a hydrosilylation catalyst, (vi) an inhibitor for hydrosilylation; (b) curing by exposure to ultraviolet light; (c) removing the uncured portion to produce a patterned core layer; (d) after a time from 20 to 300 hours depositing a second composition comprising: (i) a polysiloxane comprising epoxy groups with refractive index no greater than 1.49, and (ii) a compound comprising at least two epoxy groups with a refractive index no greater than 1.49 and an alcohol having refractive index no more than 1.45 (iii) at least one photo acid generator.

An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.