The present disclosure relates to semiconductor structures and, more particularly, to non-planar waveguide structures and methods of manufacture. The structure includes: a first waveguide structure; and a non-planar waveguide structure spatially shifted from the first waveguide structure and separated from the first waveguide structure by an insulator material.

The present disclosure relates to semiconductor structures and, more particularly, to non-planar waveguide structures and methods of manufacture. The structure includes: a first waveguide structure; and a non-planar waveguide structure spatially shifted from the first waveguide structure and separated from the first waveguide structure by an insulator material.

A photonic integrated device includes a first waveguide and a second waveguide. The first and second waveguides are mutually coupled at a junction region the includes a bulge region.

A photonic integrated device includes a first waveguide and a second waveguide. The first and second waveguides are mutually coupled at a junction region the includes a bulge region.

A system comprises a first optical component comprising a component body; at least a first waveguide formed in the component body, wherein the first waveguide is substantially mirror-symmetrical in shape relative to a line at or near the center of the first waveguide; and a self-alignment feature configured to assist in optically-coupling the first waveguide with a second waveguide located outside of the component body.

Aspects of the present disclosure are directed to configurations of compact ultra-low loss integrated photonics-based waveguides for optical gyroscope applications, and the methods of fabricating those waveguides for ease of large scale manufacturing. Four main process flows are described: (1) process flow based on a repeated sequence of oxide deposition and anneal; (2) chemical-mechanical polishing (CMP)-based process flow followed by wafer bonding; (3) Damascene process flow followed by oxide deposition and anneal, or wafer bonding; and (4) CMP-based process flows followed by oxide deposition. Any combination of these process flows may be adopted to meet the end goal of fabricating optical gyroscope waveguides in one or more layers on a silicon substrate using standard silicon fabrication technologies.

Structures that include a distributed Bragg reflector and methods of fabricating a structure that includes a distributed Bragg reflector. The structure includes a substrate, an optical component, and a distributed Bragg reflector positioned between the optical component and the substrate. The distributed Bragg reflector includes airgaps and silicon layers that alternate in a vertical direction with the airgaps to define a plurality of periods.

Structures for a grating coupler and methods of fabricating a structure for a grating coupler. The structure includes a grating coupler having a central portion and edge portions. The central portion and the edge portions define a sidewall, and the central portion and the edge portions have a first longitudinal axis along which the edge portions are arranged in a spaced relationship. Each edge portion projects from the sidewall at an angle relative to the first longitudinal axis. A waveguide core is optically coupled to the grating coupler. The first longitudinal axis is aligned in a first direction, and the waveguide core has a second longitudinal axis that is aligned in a second direction different from the first direction.

After a step of etching a core layer, a lower cladding layer, and a substrate so that a recessed opening including one end of an optical waveguide is formed relative to a multilayer board and a step of forming mask layers on a top surface of the substrate including the opening, in a step, crystal is grown with respect to the mask layers in the opening, and a tilt surface to be used as the monolithic mirror is formed. An upper cladding layer is formed covering the core layer at the same time. Then, formation of an optical waveguide pattern, formation of the optical waveguide and an end surface of the optical waveguide, formation of a dielectric film for preventing reflection, and formation of a metal film on a surface of the tilt surface are executed.

After a step of etching a core layer, a lower cladding layer, and a substrate so that a recessed opening including one end of an optical waveguide is formed relative to a multilayer board and a step of forming mask layers on a top surface of the substrate including the opening, in a step, crystal is grown with respect to the mask layers in the opening, and a tilt surface to be used as the monolithic mirror is formed. An upper cladding layer is formed covering the core layer at the same time. Then, formation of an optical waveguide pattern, formation of the optical waveguide and an end surface of the optical waveguide, formation of a dielectric film for preventing reflection, and formation of a metal film on a surface of the tilt surface are executed.