Disclosed are a method of fixing an optical fiber and a measuring apparatus using the same, in which the method includes (a) heating a fixing portion where the optical fiber is to be fixed to an object, and (b) forming a concavo-convex structure by melting the heated fixing portion. The optical fiber is fixed to the object by filling an adhesive or filler in a state in which the fixing portion having the concavo-convex structure is disposed in an insertion space formed in the object. The optical fiber and the object can be firmly fixed using the mechanical coupling structure by forming the concavo-convex portion in a part where the optical fiber is to be fixed, and slip can be prevented from occurring between the cladding and the covering jacket.

A cable marking clip for securing to a connector of a cable such that axial movement of the cable marking clip relative to the connector is prevented includes an outer portion; and an inner portion attached to the outer portion at an end. The outer portion is configured to engage a connector having strain relief grooves and the inner portion is configured to be received radially between the connector and a cable so as to prevent axial movement of the cable marking clip relative to connectors with and without strain relief grooves.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

A multi-MCP (multi-chip package) module assembly includes a plate, an integrated optical fiber shuffle disposed on the plate, a first MCP disposed on the plate, a second MCP disposed on the plate, a first optical fiber jumper disposed on the plate, and a second optical fiber jumper disposed on the plate. The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle. The integrated optical fiber shuffle includes an optical network configured to direct optical signals to and from each of the first optical fiber jumper and the second optical fiber jumper.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.

An optical connector includes: an optical fiber; a ferrule provided at an end of the optical fiber, through which a core wire of the optical fiber is inserted; a housing 9 configured to accommodate the ferrule; a fiber end face provided in the core wire of the optical fiber, located inside the ferrule from an end face of the ferrule in a state where the core wire is inserted through the ferrule; and a fixing means provided between an outer periphery of the core wire and an inner periphery of the ferrule, the fixing means configured to fix the core wire of the optical fiber to the ferrule and to fix a position of the fiber end face.

A photodetector includes: a substrate; an optical fiber disposed on the substrate; and a photodetection element fixed to the substrate, and that detects scattered light of light guided by the optical fiber. The photodetector further includes: a first fixing member and a second fixing member that fix the optical fiber to the substrate.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.