A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

An optical coupling device for routing optical signals for use in an optical communications module, in which defined on a base are a structured surface having a surface profile that reshapes and/or reflect an incident light, and an alignment structure defined on the base, configured with a surface feature to facilitate positioning an optical component on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical component. The structured surface and the alignment structure are integrally defined on the base by stamping a malleable material of the base. The alignment structure facilitates passive alignment of the optical component on the base in optical alignment with the structured surface to allow light to be transmitted along a defined path between the structured surface and the optical component. The structured surface has a reflective surface profile, which reflects and/or reshape incident light.

An optical housing for high power fiber components includes an upper cover, a lower base, and two isolating members. The upper cover includes a light-reflecting portion for containing the optical fiber and receiving and reflecting the light therefrom. The lower base is connected with the upper cover and includes a light-receiving portion which corresponds to the light-reflecting portion in position and surrounds the optical fiber, thereby receives the light from the light-reflecting portion. The isolating members are disposed between the upper cover and the lower base and located on two sides of the optical housing to prevent the leakage of light from the optical fiber.

An optical housing for high power fiber components includes an upper cover, a lower base, and two isolating members. The upper cover includes a light-reflecting portion for containing the optical fiber and receiving and reflecting the light therefrom. The lower base is connected with the upper cover and includes a light-receiving portion which corresponds to the light-reflecting portion in position and surrounds the optical fiber, thereby receives the light from the light-reflecting portion. The isolating members are disposed between the upper cover and the lower base and located on two sides of the optical housing to prevent the leakage of light from the optical fiber.

An optical fiber mold device has a first portion that includes a base layer having a longitudinal feature configured to receive an optical fiber. At least one second portion is disposed over the base layer. The second portion has a center wall and front and back end walls. The center wall, the front end wall, and the back end wall form a mold cavity. At least one first hole is disposed in the mold cavity and is configured to allow mold material to enter the mold cavity. At least one second hole in the mold cavity is configured to allow air displaced by the mold material to exit the mold cavity.

An optical fiber mold device has a first portion that includes a base layer having a longitudinal feature configured to receive an optical fiber. At least one second portion is disposed over the base layer. The second portion has a center wall and front and back end walls. The center wall, the front end wall, and the back end wall form a mold cavity. At least one first hole is disposed in the mold cavity and is configured to allow mold material to enter the mold cavity. At least one second hole in the mold cavity is configured to allow air displaced by the mold material to exit the mold cavity.

A splice sleeve holder configured to retain splice sleeves includes a base substrate and a plurality of retaining walls extending from the base substrate. The plurality of retaining walls include a first retaining wall, a second retaining wall and a third retaining wall, wherein each of the plurality of retaining walls extend from a first end to a second end in a longitudinal direction, a first channel is defined between the first retaining wall and the second retaining wall, and a second channel is defined between the second retaining wall and the third retaining wall. Each of the plurality of retaining walls includes one or more retaining protrusions, wherein the one or more retaining protrusions are arranged to retain a splice sleeve of the first channel in a vertically staggered configuration relative to a splice sleeve of the second channel.