An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.

The catheter probe comprises a catheter tip and a catheter body. The catheter tip comprises a plurality of channels for housing a plurality of optical sensors. Each one of said plurality of optical sensors comprises a ferrule comprising a via, a microlens aligned with said via and attached to said ferrule and an optical fiber for optically coupling said microlens to a monitoring means.

A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.

This invention discloses a parallel optical fiber transceiver module, comprising a laser array, a photodetector array, a driving circuit board and a two-dimensional optical fiber array; the laser array and the photodetector array are mounted in two rows on the driving circuit board, and aligned and coupled with two rows of optical fibers in the fiber array respectively, and glue is used for fixing; the two-dimensional optical fiber array is fabricated on a positioning substrate with both sides etched; the invention has the following beneficial effects: through the double-sided exposure technology in the microelectronic process, a mask pattern is made on both sides of a piece of quartz glass, and then a high-precision optical fiber positioning slot array is etched through the chemical etching process. The double-exposure photoetching machine in the microelectronic process can ensure that the mask pattern on the same side has a high positioning accuracy, thus meeting the technical requirements of the parallel optical fiber transceiver module.

A monolithic fiber-lens array includes a number of optical fibers integrated into a fiber block and multiple lens elements integrated into a lens block. The fiber block is coupled to the lens block via a transparent adhesive layer, and the tips of the optical fibers are aligned with respective focal points of the lens elements.

A monolithic fiber-lens array includes a number of optical fibers integrated into a fiber block and multiple lens elements integrated into a lens block. The fiber block is coupled to the lens block via a transparent adhesive layer, and the tips of the optical fibers are aligned with respective focal points of the lens elements.

An optical fiber bundle structure includes: plural optical fiber core wires; a crossing preventing member; and a grasping member. Further, the crossing preventing member has slits and the widths of the slits positioned at the respective sides are each equal to or larger than a difference between: a length of one side of a polygon circumscribing the plural optical fiber core wires at a hindmost end portion of the slits at the trailing end; and a length of one side of a polygon circumscribing the plural optical fiber core wires at the leading end.

A data center network device provides configurations where the port density can be increased by incorporating multiport transceivers within the device and the use of high density fiber connections on exterior panels of the device. The device also permits dynamically reassigning fiber connections to convert from single fiber connection paths to higher rate bonded fiber paths while at the same time making more efficient use of the fiber interconnections.

A monolithic fiber-lens array includes a number of optical fibers integrated into a fiber block and multiple lens elements integrated into a lens block. The fiber block is coupled to the lens block via a transparent adhesive layer, and the tips of the optical fibers are aligned with respective focal points of the lens elements.