A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

A method for manufacturing an array of optical fiber ferrules includes producing on a first side of a wafer a pattern of an array of disks or holes (111, 112) in a metallic coating (121, 122). The metallic coating is covered with a negative photoresist layer. A second side of the wafer opposite to the first side is illuminated with light that propagates as a divergent or collimated beam through the photoresist layer, thereby creating a conical pattern within the photoresist layer. The photoresist layer is developed to create conical apertures. A sheet with a conical openings pattern registered to the conical apertures is attached so that a small diameter of each conical opening of the sheet is smaller than, and in contact with, a large diameter of the conical aperture to which it is registered, thereby forming an array of optical fiber ferrules.

Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

An optical waveguide is configured to guide an optical beam, and the optical waveguide includes a down-taper element configured to reduce a diameter of an incoming light beam having a random polarization; a dual-core directional coupler element configured to separate the incoming light beam into a horizontally-polarized beam and a vertically-polarized beam, each beam being confined in first and second cores, respectively; and a core fan-out element configured to increase a distance between the horizontally-polarized beam and the vertically-polarized beam upon exit from the core fan-out element. Each of the down-taper element, the dual-core directional coupler element, and the core fan-out element are 3-dimensional, 3D, printed using a single material.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.