An optical transmission module is configured such that: a first optical device is provided on an upper surface of an optical waveguide substrate; a second optical device is provided on a lower surface of the optical waveguide substrate; a V-groove is formed on an end face of the optical waveguide substrate, the V-groove including a first reflective face and a second reflective face as wall faces; the first optical device is optically coupled with an optical waveguide via the first reflective face; and the second optical device is optically coupled with the optical waveguide via the second reflective face.

One example LIDAR device comprises a substrate and a waveguide disposed on the substrate. A first section of the waveguide extends lengthwise on the substrate in a first direction. A second section of the waveguide extends lengthwise on the substrate in a second direction different than the first direction. A third section of the waveguide extends lengthwise on the substrate in a third direction different than the second direction. The second section extends lengthwise between the first section and the second section. The LIDAR device also comprises a light emitter configured to emit light. The waveguide is configured to guide the light inside the first section toward the second section, inside the second section toward the third section, and inside the third section away from the second section.

The invention refers to a photonic integrated circuit (PIC), the photonic integrated circuit comprising: at least one laser, the laser having a laser output, a measuring portion including a measuring port and configured to measure an intensity and/or wavelength of light input at the measuring port, and an output portion configured to output light from the photonic integrated circuit to the portion of the tissue, wherein optionally the laser includes a ring resonator laser, a laser generating light having a fixed wavelength, a laser being constructed using hybrid integration, and/or a tunable laser.

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

The various embodiments described herein include methods, devices, and systems for fabricating and operating superconducting photon detectors. In one aspect, a photon detector includes: (1) a first waveguide configured to guide photons from a photon source; (2) a second waveguide that is distinct and separate from the first waveguide and optically-coupled to the first waveguide; and (3) a superconducting component positioned adjacent to the second waveguide and configured to detect photons within the second waveguide.

An example imaging apparatus that can operate at shortwave infrared (SWIR) wavelengths are provided. An example imaging apparatus may include a fiber optic bundle, a distal lens, an illumination assembly, and an imaging detector. The fiber optic bundle may comprise a plurality of fibers and may be configured to guide light energy at a SWIR wavelength. The distal lens may be disposed on a distal end of the fiber optic bundle and the distal lens configured to focus light energy at the SWIR wavelength. The illumination assembly may be configured to output illumination at the SWIR wavelength adjacent to the distal end of the fiber optic bundle toward an object. The imaging detector may be operably coupled to a proximal end of the fiber optic bundle and configured to receive imaging light energy at the SWIR wavelength reflected from the object and guided through the fiber optic bundle.

Waveguides, such as light guides, made entirely of elastomeric material or with indents on an outer surface are disclosed. These improved waveguides can be used in scissors, soft robotics, or displays. For example, the waveguides can be used in a strain sensor, a curvature sensor, or a force sensor. In an instance, the waveguide can be used in a hand prosthetic. Sensors that use the disclosed waveguides and methods of manufacturing waveguides also are disclosed.

A sensor for determining a liquid type, includes: a plano-convex lens; a lens holder configured to support the plano-convex lens via an edge of the lens; an outputting optical fiber that abuts against a plane surface of the plano-convex lens to output light; a light-receiving optical fiber that abuts against the plane surface of the plano-convex lens to receive light; a light-emitting unit connected to the outputting optical fiber; and a light amount measuring unit connected to the light-receiving optical fiber to measure a light amount. The outputting optical fiber is provided so that an end face of the outputting optical fiber is disposed on the edge of the plano-convex lens, and preferably, a central axis thereof at the end face thereof passes through the plane surface of the plano-convex lens.

An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.