An optical element device includes an opto-electric hybrid board sequentially including an optical waveguide having a mirror, and an electric circuit board having a terminal in a thickness direction, and an optical element optically connected to the mirror and electrically connected to the terminal. The opto-electric hybrid board includes a mounting region including the mirror and the terminal when projected in the thickness direction and mounted with the optical element. Furthermore, the opto-electric hybrid board includes an alignment mark for aligning the optical element with respect to the mirror. The alignment mark is made of a material for forming the optical waveguide, and disposed at both outer sides of the mounting region in a width direction.

An optical transmission module includes a substrate having an opening portion; an optical element closing an opening on the lower surface side of the substrate and converting an electric signal into an optical signal or the optical signal into the electric signal; an optical fiber transmitting the optical signal; a ferrule closing an opening on the upper surface side of the substrate and having an optical fiber insertion hole; and a resin filled into a space surrounded at least by the substrate, the optical element, the ferrule, and a distal end of the optical fiber, wherein the ferrule has a resin filling hole spaced apart from the optical fiber insertion hole to fill the space with the resin, and an angle formed by an axis of the optical fiber insertion hole and an axis of the resin filling hole is equal to or more than 0° and less than 90°.

Structures that include a distributed Bragg reflector and methods of fabricating a structure that includes a distributed Bragg reflector. The structure includes a substrate, an optical component, and a distributed Bragg reflector positioned between the optical component and the substrate. The distributed Bragg reflector includes airgaps and silicon layers that alternate in a vertical direction with the airgaps to define a plurality of periods.

A distributed optical fiber sensing (DOFS)/distributed acoustic sensing (DAS) method employing polarization diversity combining and spatial diversity combining for a DOFS/DAS system wherein the polarization diversity combining determines a temporal average product for each beating product, determines one having a max average power, rotates that one having max average power for its phase shift to produce a reference, determines a phase difference for each beating product as compared to the reference, compensates any phase difference such that all beating products exhibit a well-aligned phase; and combining the beating products; and wherein the spatial diversity combining uses the combined beating products for each location, determines a temporal average power, determines a location having a greatest average power; and combines the results and provides an indicia of the combined result(s).

An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

A packaging structure and a packaging method of edge couplers and a fiber array are provided. The packaging structure includes a silicon substrate, an edge coupler, and a fiber array. Multiple edge couplers are arranged in a main body portion of the silicon substrate, and an end of the edge coupler extends to a step groove of the silicon substrate. At least a part of the cover of the fiber array is accommodated in the step groove. Multiple fibers in the fiber array correspondingly pass through multiple lead channels of the cover and are then coupled with the edge couplers in the step groove. The edge couplers butt the fibers in the fiber array. The cover is moved until a part of the cover is accommodated in the step groove, so that the fibers can be aligned with the edge couplers in the step groove.

An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating material with the active side facing down; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the backside of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC.

A photonic coupler includes an input coupling section, an output coupling section, and a multimode interference (MMI) waveguide section. The input coupling section is adapted to receive an input optical signal along an input waveguide channel. The output coupling section is adapted to output a pair of output optical signals along output waveguide channels. The output optical signals having output optical powers split from the input optical signal. The MMI waveguide section is optically coupled between the input and output coupling sections. Notched waveguide sections may each be disposed between the MMI waveguide section and a corresponding one of the input or output coupling sections and/or the MMI waveguide section may include curvilinear sidewalls.