The present invention provides a photodiode for a wearable sensor system, the photodiode having a rectangular active area sensitive to wavelengths within the spectral range of 1200 nm to 2400 nm. The present invention also provides a wearable sensor system comprising the photodiode.

A coaxial lidar system includes one or more emitter channels and one or more sensor channels that share an optical module. A diffractive waveguide can be used to redirect received light from the shared optical module to the sensor channels.

Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.

Multidrop optical connections are used for an optical memory module. Multiple buffer integrated circuits on a module each receive information from the host system using different wavelengths of light transmitted on the same waveguide. Multiple buffer integrated circuits each transmit information back to the CPU using different wavelengths of light transmitted on another waveguide. Wavelength resonant ring couplers disposed on the buffer integrated circuits are used to separate the wavelength being received by a particular buffer integrated circuit from the wavelengths of light destined for other buffer integrated circuits on the same waveguide. Wavelength resonant ring modulators also disposed on the buffer integrated circuits modulate specific wavelengths of light unique to each buffer integrated circuit to transmit information to the CPU.

An optical transmission module is configured such that: a first optical device is provided on an upper surface of an optical waveguide substrate; a second optical device is provided on a lower surface of the optical waveguide substrate; a V-groove is formed on an end face of the optical waveguide substrate, the V-groove including a first reflective face and a second reflective face as wall faces; the first optical device is optically coupled with an optical waveguide via the first reflective face; and the second optical device is optically coupled with the optical waveguide via the second reflective face.

An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.

Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

An optical source switching apparatus including first optical sources, an optical cross-connect device, second optical sources, and a first coupler. The optical cross-connect device is connected to the first optical sources and the first coupler, and the first coupler is connected to the second optical source; both the first optical source and the second optical source are configured to output continuous optical energy, and the optical cross-connect device is configured to enable optical energy output by at least one of the first optical sources to enter the first coupler when at least one of the second optical sources fails; and the first coupler is configured to implement beam splitting of the optical energy output by the first optical source or the second optical source.

A method for manufacturing a semiconductor device is provided. The method includes: providing a semiconductor-on-insulator substrate including a first substrate, a first insulating layer on the first substrate, and a semiconductor layer on the first insulating layer; patterning the semiconductor layer to form a grating coupler; forming one or more functional layer stacked with each other on a side of the semiconductor layer that faces away from the first insulating layer; bonding the one or more functional layer to a carrier substrate on a side of the one or more functional layer that faces away from the semiconductor layer; and completely removing the first substrate to provide, by the first insulating layer instead of the first substrate, an optical transmission channel between the grating coupler and an outside of the semiconductor device that is located on a side, facing away from the semiconductor layer, of the first insulating layer.

A vacuum fluctuation quantum random number generator chip includes a heat sink substrate, a laser fixed to a first end of the heat sink substrate, at least two photoelectric detectors fixed to a second end of the heat sink substrate, and a beam splitter fixed to the heat sink substrate and located between the laser and the at least two photoelectric detectors. Light of the laser propagates through the beam splitter. The at least two photoelectric detectors are respectively positioned at optical path outlets of the beam splitter.