Embodiments of the present disclosure include optical transmitters and transceivers with improved reliability. In some embodiments, the optical transmitters are used in network devices, such as in conjunction with a network switch. In one embodiment, lasers are operated at low power to improve reliability and power consumption. The output of the laser may be modulated by a non-direct modulator and received by integrated optical components, such as a modulator and/or multiplexer. The output of the optical components may be amplified by a semiconductor optical amplifier (SOA). Various advantageous configurations of lasers, optical components, and SOAs are disclosed. In some embodiments, SOAs are configured as part of a pluggable optical communication module, for example.

An optical fiber connector, a single-fiber bidirectional optical assembly, and an optical fiber transmission system are provided. The optical fiber connector is used in a single-fiber bidirectional optical assembly that includes a first optical module and a light filter. The optical fiber connector includes an optical path changing module, an optical fiber, a ferrule, and a tube. The optical fiber is disposed in the ferrule, the optical path changing module is in physical contact with the ferrule, the optical path changing module and the ferrule are fastened through the tube, and an optical path port is disposed at a location that is on the tube opposite from the first optical module. The optical path changing module is configured to change a transmission path of a first optical signal.

Embodiments described herein may be related to apparatuses, processes, and techniques related to a cavity created in a package substrate, where the surface of the substrate at the bottom of the cavity, or alignment features at the surface of the substrate at the bottom of the cavity are used to accurately align a lens of a FAU to a lens of a PIC. In embodiments, the surface of the substrate at the bottom of the cavity has additional standoff pedestal features to aid in height tolerance control of the FAU to properly align the FAU lens when attached. Other embodiments may be described and/or claimed.

A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

There is provided a light emitting element and an optical waveguide that propagates light from the light emitting element. For example, the optical waveguide is an optical fiber or a silicon optical waveguide. The light propagating through the optical waveguide is light having components of a fundamental mode and a first order mode, and the light propagates through the optical waveguide while having a light intensity distribution in which high intensity portions alternately appear in one direction and another direction opposite to the one direction with respect to the center of a core along the optical waveguide. A light intensity distribution at an output end surface of the optical waveguide is a light intensity distribution corresponding to an intermediate position between a first position where the high intensity portion is in the one direction and a second position where the high intensity portion is in the another direction. In a case of propagating the light having the components of the fundamental mode and the first order mode, it is possible to obtain favorable coupling efficiency regardless of a direction of an optical axis deviation, as in a case of propagating light having only the component of the fundamental mode. A cost is thus reduced by reducing accuracy of positional deviation.

Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

An optical device that includes a multicore optical fiber having at least two cores. An alignment feature is attached at the first end of the first multicore optical fiber. The device also includes a substrate having at least two waveguides, each waveguide comprising a redirecting feature. A fiber holder is located on the substrate to hold the multicore fiber in a correct axially rotational orientation using the alignment feature, so that light couples between the cores of the multicore fiber and respective waveguides in the substrate.

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

In accordance with a plurality of embodiments of the present invention, exemplary systems and articles of manufactures are described herein that are configured to propagate a MM signal from a light source, such as an optical fiber assembly for propagating a multimode (MM) signal from a light source, the optical fiber assembly comprising a multicore fiber (MCF) having a fiber numerical aperture (NA) value, a first core diameter and a first outer diameter (OD), and a combiner including a taper fiber bundle (TFB) portion in communication with the MCF, and at least one pigtail portion in communication with the light source, wherein the combiner propagates the MM signal from the light source, the MM signal having a signal NA value that is less than the fiber NA value such that the MM signal underfills the at least one pigtail portion.