Systems and methods for coupling photonic integrated subcircuits are described herein. The example system can include a first cartridge (4702) including a first photonic integrated subcircuit (4706) and a first alignment feature (4720, 4722). The system can include a second cartridge (4704) including a second photonic integrated subcircuit (4708) and a second alignment feature (4724, 4726), where the first alignment feature (4720, 4722) and the second alignment feature (4724, 4726) can be configured to enable alignment between the first photonic integrated subcircuit (4706) and the second photonic integrated subcircuit (4708). When the first photonic integrated subcircuit (4706) is aligned to the second photonic integrated subcircuit (4708), a first light path of the first photonic integrated subcircuit (4706) can be optically coupled to a second light path of the second photonic integrated subcircuit (4708).

An optical circuit board of the present disclosure includes a wiring board and an optical waveguide located on the wiring board. The optical waveguide includes a lower cladding layer, a core located on the lower cladding layer, an upper cladding layer located on the lower cladding layer and covering the core, a first cavity extending from the upper cladding layer to the lower cladding layer and dividing the core, and at least two second cavities extending from the upper cladding layer to the lower cladding layer and located with the core therebetween in plan view. The first cavity has a first opening portion located on the upper cladding layer side and a first bottom portion located on the lower cladding layer side. The second cavities each include a second opening portion located on the upper cladding layer side and a second bottom portion located on the lower cladding layer side.

A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.

Some embodiments may include a method of generating assessment data in a system including a galvanometric scanning system (GSS) having a laser device to generate a laser beam and an X-Y scan head module to position the laser beam on a work piece. The method may include selecting a dimension based on a desired accuracy for validation (and/or a characteristic of an imaging system in embodiments that utilize an imaging system). The method may include commanding the GSS to draw a mark based on a polygon or ellipse of the selected dimension around a predetermined target point associated with the work piece to generate assessment data, and following operation of the GSS based on said commanding, validating a calibration of the GSS using the assessment data (or an image thereof in embodiments that utilize an imaging system). Other embodiments may be disclosed and/or claimed.

Various embodiments provide a method for fabricating a couplable electro-optical device. In an example embodiment, the method includes fabricating at least one raw electro-optical device on a substrate; applying lens material to a working stamp; aligning the substrate and the working stamp; pressing the substrate onto the lens material until the distance between the substrate and the working stamp is a predetermined distance; and curing the lens material to form an integrated lens secured to the at least one electro-optical device on the substrate. An anti-reflective coating layer may be optionally applied on top of the molded lens. The couplable electro-optical device may be incorporated into a receiver, transmitter, and/or transceiver using passive alignment to align the couplable electro-optical device to an optical fiber.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In the illustrative embodiment, a lens assembly with one or more lenses is positioned to collimate light coming out of one or more waveguides in the PIC die. Part of the illustrative lens assembly extends above a top surface of the PIC die and is in contact with the PIC die. The top surface of the PIC die establishes the vertical positioning of the lens assembly. In the illustrative embodiment, the lens assembly is positioned at least partially inside a cavity defined within the PIC die, which allows the lens assembly to be integrated at the wafer level, before singulation into individual dies.

A semiconductor optical device includes: a base configured to intersect with a first direction; a first protrusion configured to protrude from the base in the first direction, the first protrusion including a planar lightwave circuit including: a core layer; and a cladding layer surrounding the core layer; a second protrusion configured to protrude from the base in the first direction and arranged along the first protrusion in a second direction intersecting with the first direction, a height of the second protrusion from the base in the first direction being lower than a height of the first protrusion; an optical semiconductor element placed on a facet of the second protrusion in the first direction and optically connected to the core layer; and a marker provided on the second protrusion in a manner exposed on the facet, the marker being made of a same material as the core layer.

An optical fiber splicing tray is disclosed. The optical fiber splicing tray may include: an optical fiber splicing tray body; and a marker detachably connected to the optical fiber splicing tray body, where the marker is arranged at a position facilitating observation and identification of the marker when a plurality of optical fiber splicing trays are stacked.

A device providing efficient transformation between an initial optical mode and a second optical mode includes first, second and third elements fabricated on a common substrate. The first element includes first and second active sub-layers supporting initial and final optical modes with efficient mode transformation therebetween. The second element includes a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the first element, includes an intermediate waveguide structure supporting an intermediate optical mode. If the final optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in the second or third elements facilitates efficient transformation between the intermediate optical mode and the second optical mode. Precise alignment of sub-elements formed in one of the elements, relative to sub-elements formed in another one of the elements, is defined using lithographic alignment marks.