An optical element device includes an opto-electric hybrid board sequentially including an optical waveguide having a mirror, and an electric circuit board having a terminal in a thickness direction, and an optical element optically connected to the mirror and electrically connected to the terminal. The opto-electric hybrid board includes a mounting region including the mirror and the terminal when projected in the thickness direction and mounted with the optical element. Furthermore, the opto-electric hybrid board includes an alignment mark for aligning the optical element with respect to the mirror. The alignment mark is made of a material for forming the optical waveguide, and disposed at both outer sides of the mounting region in a width direction.

An alignment apparatus and an alignment method that enables to align an optical device with a receptacle, where the optical device and the receptacle have respective axes tilted to each other. The method includes steps of: (1) obtaining a minimum pressure caused to the optical device from the receptacle as varying a rolling angle around the X-axis of the optical device but fixing the pitching angle around the Y-axis at a rotating angle around the Z-axis; (2) determining a rotating angle where thus obtained minimum pressure becomes the minimum; and (3) iterating those procedures until the rotating angle obtained as varying the rolling angle and another rotating angle obtained as varying the pitching angle substantially coincides to each other.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Embodiments described herein may be related to apparatuses, processes, and techniques related to a cavity created in a package substrate, where the surface of the substrate at the bottom of the cavity, or alignment features at the surface of the substrate at the bottom of the cavity are used to accurately align a lens of a FAU to a lens of a PIC. In embodiments, the surface of the substrate at the bottom of the cavity has additional standoff pedestal features to aid in height tolerance control of the FAU to properly align the FAU lens when attached. Other embodiments may be described and/or claimed.

Disclosed is a micro-optical interconnect component including an optical platform including, arranged onto a substrate, at least one optical alignment structure fixing an optical component and/or arranged as alignment structure to adapt another interconnect component. The optical platform includes a light deflecting element, having a total volume of less than 1 mm3, and made of a material having a refractive index higher than 1. The light deflecting element includes a face, facing the optical alignment structure, and has a curved reflecting surface so that an incident light beam onto the first face is deflected by an angle between 60° and 120°, the incident light beam may be provided from the outside or the inside of the substrate. Also disclosed are optical devices including at least one optical interconnect component and to optical systems including at least one optical device, as well as a batch fabrication process of the optical interconnect component

Various embodiments provide a method for fabricating a couplable electro-optical device. In an example embodiment, the method includes fabricating at least one raw electro-optical device on a substrate; applying lens material to a working stamp; aligning the substrate and the working stamp; pressing the substrate onto the lens material until the distance between the substrate and the working stamp is a predetermined distance; and curing the lens material to form an integrated lens secured to the at least one electro-optical device on the substrate. An anti-reflective coating layer may be optionally applied on top of the molded lens. The couplable electro-optical device may be incorporated into a receiver, transmitter, and/or transceiver using passive alignment to align the couplable electro-optical device to an optical fiber.

A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.

An electronic device and a light pipe apparatus advantageously are formed of a relatively small number of components that are configured to provide various types of light at the exterior of the electronic device while detecting ambient light at the exterior of electronic device, while also providing weather seals that protect the interior of electronic device without requiring the use of additional components to provide such seals.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

The present invention relates to an optical assembly comprising a first optical circuit and a second optical circuit. The invention further relates to an optical device in which the first and second optical circuit are fixedly connected to each other. In addition, the present invention relates to a method for manufacturing the optical device. According to the invention, flexible waveguide ends of waveguides on the second optical circuit are used that extend upwards from the second optical circuit to optically couple to waveguides on the first optical circuit.