An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

An optical element device includes an opto-electric hybrid board sequentially including an optical waveguide having a mirror, and an electric circuit board having a terminal in a thickness direction, and an optical element optically connected to the mirror and electrically connected to the terminal. The opto-electric hybrid board includes a mounting region including the mirror and the terminal when projected in the thickness direction and mounted with the optical element. Furthermore, the opto-electric hybrid board includes an alignment mark for aligning the optical element with respect to the mirror. The alignment mark is made of a material for forming the optical waveguide, and disposed at both outer sides of the mounting region in a width direction.

A multi-channel parallel optical communication module includes a casing having an airtight cavity, an optical communication assembly accommodated in the airtight cavity, and a temperature controller in thermal contact with the optical communication assembly. The optical communication assembly includes a plurality of optical communication units disposed at same level, and a number of the plurality of optical communication units is greater than four.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

Embodiments of the present disclosure include optical transmitters and transceivers with improved reliability. In some embodiments, the optical transmitters are used in network devices, such as in conjunction with a network switch. In one embodiment, lasers are operated at low power to improve reliability and power consumption. The output of the laser may be modulated by a non-direct modulator and received by integrated optical components, such as a modulator and/or multiplexer. The output of the optical components may be amplified by a semiconductor optical amplifier (SOA). Various advantageous configurations of lasers, optical components, and SOAs are disclosed. In some embodiments, SOAs are configured as part of a pluggable optical communication module, for example.

Disclosed are structures and methods for active optic cable (AOC) assembly having improved thermal characteristics. In one embodiment, an AOC assembly includes a fiber optic cable having a first end attached to a connector with a thermal insert attached to the housing for dissipating heat from the connector. The AOC assembly can dissipate a suitable heat transfer rate from the active components of the connector such as dissipating a heat transfer rate of 0.75 Watts or greater from the connector. In one embodiment, the thermal insert is at least partially disposed under the boot of the connector. In another embodiment, at least one component of the connector has a plurality of fins. Other AOC assemblies may include a connector having a pull tab for dissipating heat from the assembly.

An optical receptacle includes: an optical receptacle body; two supporters which are connected to a respective end of the optical receptacle body, wherein each supporter is connected to one end of the optical receptacle body at a central portion of the respective supporter, and the two supporters face each other with a space therebetween; and four adhesive reservoirs which are disposed at respective four corners of the optical receptacle in plan view, wherein each of the adhesive reservoirs is a through hole or a recess, and the through hole or the recess is surrounded circumferentially by the supporter. The optical receptacle body and the two supporters together have a plane symmetrical shape with respect to a plane parallel to an optical axis of the light emitted from each of the second optical surfaces. The four adhesive reservoirs are disposed plane symmetrically with respect to the plane.

An optical module includes a lens sheet having one or more lenses, a substrate having a photoelectric conversion device mounted on a first face thereof and having a first penetrating hole formed therethrough between the photoelectric conversion device and the one or more lenses, and an adhesive layer configured to bond a face of the lens sheet to a second face of the substrate, wherein the adhesive layer has a second penetrating hole formed therethrough between the one or more lenses and the photoelectric conversion device, and a pathway is provided to connect a space constituted by the first penetrating hole and the second penetrating hole to an outside of the space.

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

An optical circuit board of the present disclosure includes a wiring board and an optical waveguide located on the wiring board. The optical waveguide includes a lower cladding layer, a core located on the lower cladding layer, an upper cladding layer located on the lower cladding layer and covering the core, a first cavity extending from the upper cladding layer to the lower cladding layer and dividing the core, and at least two second cavities extending from the upper cladding layer to the lower cladding layer and located with the core therebetween in plan view. The first cavity has a first opening portion located on the upper cladding layer side and a first bottom portion located on the lower cladding layer side. The second cavities each include a second opening portion located on the upper cladding layer side and a second bottom portion located on the lower cladding layer side.