A multi-channel parallel optical communication module includes a casing having an airtight cavity, an optical communication assembly accommodated in the airtight cavity, and a temperature controller in thermal contact with the optical communication assembly. The optical communication assembly includes a plurality of optical communication units disposed at same level, and a number of the plurality of optical communication units is greater than four.

An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

An optical waveguide package includes a substrate including a first surface and a second surface opposite to the first surface, a cladding located on the second surface and including a third surface facing the second surface, a fourth surface opposite to the third surface, and an element-receiving portion with an opening in the fourth surface, a core located in the cladding and extending from the element-receiving portion, and a first metal member located in the element-receiving portion in a plan view as viewed in a direction toward the fourth surface and including an element mount. The first metal member is connected to a second metal member with a first via conductor extending through the substrate from the first surface to the second surface.

Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.

An adapter includes a waterproof container, a photoelectric conversion device housed in the waterproof container and connected to an optical cable, and an attachment structure provided at the waterproof container, for use in detachably attaching the adapter to an ROV.

The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

The present disclosure describes active optical cable assemblies. A cable assembly includes a fixed active optical connector having a transceiver, a ruggedized optical fiber cable integrated with the fixed active optical connector, a main cable assembly comprising one or more optical fiber cables, wherein the ruggedized cable is spliced to the main cable assembly; and a removable shroud configured to surround at least a portion of the fixed active optical connector plugged into a remote radio unit and to be secured to a remote radio unit. Active optical cable and remote radio unit systems are also described.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

The present disclosure describes sealing boots for protecting an optical interconnection. A sealing boot may include a main body having an interior cavity, the interior cavity having an annular recess adjacent to one end of the main body, the annular recess configured to receive a feature of a remote radio unit, and a neck merging with the opposing end of the main body and having a cylindrical inner surface that defines a bore that is continuous with the cavity of the main body, the inner surface having an inner diameter that is less than an inner diameter of the interior cavity of the main body. The sealing boot is configured to surround at least a portion of a fixed active optical connector when the fixed active optical connector is plugged into the remote radio unit.