A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

Coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic having a fibre optic comprising an end portion with a front face, as well as a moulded part made of optically transparent material, wherein the end portion of the fibre optic is arranged in the moulded part and is connected to the moulded part in a positively locking manner. Furthermore, a method for producing a coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic, has the following steps: A) providing a mould with a mould space, B) inserting an end portion of a fibre optic having the front face into the mould space, C) filling the mould space with an optically transparent material in flowable form, D) solidifying the optically transparent material into a moulded part.

Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

An IC device includes a heat spreader, an electronic component over the heat spreader, an optical component over the electronic component, a multilayer structure over the optical component, and a redistribution structure over the multilayer structure. The multilayer structure includes a waveguide optically coupled to the optical component. The redistribution structure is electrically coupled to the electronic component by vias through the optical component and the multilayer structure.

A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface to optically couple a fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a mold.

Embodiments herein relate to systems, apparatuses, or processes for creating an integrated photonics package that includes a photonics IC, an electronic IC, and an optical coupling connector that are molded within a single package. In embodiments, caps may be used to protect optical components during manufacture. Other embodiments may be described and/or claimed.

A connector and a connector set that can be fabricated by using a mold including a smaller number of components.

To provide a receptacle and a connector set, and a method of fabricating the receptacle with which the occurrence of fabrication variation of the positional relationship between a positioning portion or a positioning surface and a lens can be suppressed. The receptacle is a resin member formed by a first half of a mold and a second half of the mold to be mated with the first half of the mold. At least part of a first positioning portion, at least part of a second positioning portion, and a lens are positioned on one side in a direction relative to a parting line formed at a boundary between the first half of the mold and the second half of the mold.