A display device includes a cover structure, a light guide plate, and a display panel. The cover structure includes an anti-glare layer, a light blocking frame, and an adhesive layer. The anti-glare layer has a display region and an non-display region. The light blocking frame surrounds a receiving space. An orthogonal projection of the light blocking frame on the anti-glare layer is located within the non-display region. An adhesive layer is located in the receiving space of the light blocking frame. The light guide plate is located on the surface of the adhesive layer facing away from the anti-glare layer. The display panel is adjacent to the light guide plate.

Coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic having a fibre optic comprising an end portion with a front face, as well as a moulded part made of optically transparent material, wherein the end portion of the fibre optic is arranged in the moulded part and is connected to the moulded part in a positively locking manner. Furthermore, a method for producing a coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic, has the following steps: A) providing a mould with a mould space, B) inserting an end portion of a fibre optic having the front face into the mould space, C) filling the mould space with an optically transparent material in flowable form, D) solidifying the optically transparent material into a moulded part.

Embodiments disclosed herein include electronic packages with a core that includes an optical waveguide and methods of forming such electronic packages. In an embodiment, a package substrate comprises a core, and a photonics die embedded in the core. In an embodiment, the electronic package further comprises an optical waveguide embedded in the core. In an embodiment, the optical waveguide optically couples the photonics die to an edge of the core.

Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

A camera apparatus records only those objects in a surround which are situated in a predetermined object plane at a distance from the camera apparatus. To this end, the camera apparatus includes an illumination device for illuminating the desired object with an illumination light and an image capture device (for capturing the illumination light reflected by the object. For recording that is dependent on the object plane, the camera apparatus additionally comprises a control device for driving the illumination device to provide the illumination light in the form of light pulses and for controlling the image capture device to capture the reflected illumination light within recording intervals assigned to the light pulses. To avoid interference effects on a resultant image representation, provision is additionally made for a deflection unit for deflecting the respective illumination light between the surround and the illumination device and the image capture device.

Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.

Realized is a bonding method which makes it possible to cause an angle formed between a front surface of an optical element and an upper end surface of a housing side wall to accurately match a design objective value. The bonding method includes the steps of (a) placing an optical element (12) on a jig (2) so that a front surface (12a) of the optical element (12) is in surface contact with a first flat surface (23a) of the jig'(2); and (b) placing a housing (11) on the jig (2) so that (i) an upper end surface (11a1) of a side wall (11a) of the housing (11) is in surface contact with a second flat surface (21a) of the jig (2) and (ii) a bottom plate (11b) of the housing (11) is in contact with a back surface (12h) of the optical element (12) via an adhesive (15).

The present invention is directed to an optical member including: a first layer that includes a first region having a refractive index n.sub.1 and a second region having a refractive index n.sub.3; and a second layer disposed on a first main surface of the first layer so as to be in contact with the first region and the second region, the second layer having a refractive index n.sub.2. The first layer includes a plurality of said second regions adjoining the first region along a planar direction of the first layer; the plurality of second regions constitute a geometric pattern; and n.sub.1 to n.sub.3 satisfy the relationship n1<n3<n2. When an optical member according to the present invention is integrated with a lightguide in use, excellent light extraction function is exhibited and leakage of light due to light scattering is suppressed, while attaining good mechanical strength at the same time.

An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.

Provided is an optical module having high efficiency in optical coupling to a functional element on a substrate. An optical module includes: a first optical waveguide disposed parallel to a substrate; a condensing mirror configured to reflect and condense light propagated in the first optical waveguide toward the substrate; a second optical waveguide formed in a tapered shape narrowed toward the substrate, the second optical waveguide guiding the light reflected by the condensing mirror to the vicinity of the surface of the substrate; and an optical function unit disposed on the substrate such that the light emitted from the second optical waveguide is incident on the optical function unit.