Patent classifications
G02B6/426
OPTOELECTRONIC MODULE FOR RECEIVING MULTIPLE OPTICAL CONNECTORS
An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.
FIBER OPTIC CONNECTOR
A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.
SUBMOUNT ARCHITECTURE FOR MULTIMODE NODES
Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on or in a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.
Optical module
To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.
High density optical I/O inside a data center switch using multi-core fibers
A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.
OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC COMPOSITE TRANSMISSION MODULE
An opto-electric hybrid board includes an optical waveguide extending in the longitudinal direction and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide and extending in the longitudinal direction. The electric circuit board includes a first terminal disposed in a one end portion in the longitudinal direction of a one-side surface in the thickness direction of the electric circuit board and being for mounting the optical element, and a second terminal disposed in the one end portion in the longitudinal direction of the one-side surface in the thickness direction of the electric circuit board and being for mounting a driver element electrically connected with the optical element. The electric circuit board has one edge in the longitudinal direction at one side in the longitudinal direction as compared to one edge in the longitudinal direction of the optical waveguide.
OPTICAL DEVICE AND MANUFACTURING METHOD FOR OPTICAL DEVICE
An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.
OPTICAL MODULE
An optical module includes a shell, a circuit board, a display light and a light guide pipe. The circuit board is disposed in the shell. The display light is disposed on the circuit board, and is configured to emit light of different colors. The light guide pipe is disposed between the shell and the circuit board. An input end of the light guide pipe is arranged to correspond to the display light, an output end of the light guide pipe is configured to transmit light emitted by the display light to an outside of the optical module. The shell includes a groove. The output end of the light guide pipe is fixed in the groove, so that the shell is fixed with the light guide pipe.
OSFP optical transceiver with a dual MPO receptacle
An OSFP optical transceiver having split multiple fiber optical port using reduced amount of MPO terminations is provided that includes two adjacent sockets integrated into the optical port of the OSFP optical transceiver. The two adjacent sockets are vertically oriented with respect to the mounting baseplate of the OSFP optical transceiver, and each of the two adjacent sockets is adapted to receive an MPO receptacle that terminates the proximal end of a bundle of fibers. The OSFP optical transceiver also includes an optical connection between each socket and a corresponding lens in the OSFP optical transceiver, for transmitting optical signals received from other transceivers into the OSFP optical transceiver and optical signals generated in the OSFP optical transceiver to other transceivers.
Fiber optical transceiver and optical communication module
A fiber optical transceiver includes a package, a plurality of lead frames provided with the package and protruding outward from the package, a first circuit board installed in the package and electrically connected to the plurality of lead frames, and an optical element provided on the first circuit board. The package includes a ceramic portion formed of ceramic and covered with a metallized film.