One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

A method for manufacturing an electronic component includes preparing a mounting substrate provided with a first region to mount an electronic component thereon and a second region having conductivity, covering the second region with resin, applying a metal paste on the first region, mounting the electronic component on the first region with the metal paste, and removing the resin covering the second region. The mounting includes heating the mounting substrate to cure the metal paste with the electronic components being placed on the metal paste applied on the first region. The resin peeled from the second region by the heating is removed in the removing.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

An optical receptacle is disposed between a light-emitting element and an optical transmission member and configured to optically couple the light-emitting element and the optical transmission member, the optical receptacle including an incidence surface configured to allow incidence of light emitted from the light-emitting element; and an emission surface configured to emit, toward the optical transmission member, light entered from the incidence surface and travelled inside the optical receptacle, the emission surface being an inner surface of a recess. The emission surface includes a first emission surface having a substantially spherical cap shape, and a second emission surface contiguous with the first emission surface, the second emission surface having a shape of a side surface of a substantially frustum shape.

A bi-directional optical transceiver module includes: an optical transmission unit to output a transmission signal; an optical reception unit to receive a reception signal, the transmission signal and the reception signal having different corresponding first and second wavelength values within a single channel; a splitter, inclined with respect to an incident direction of the transmission signal output from the optical transmission unit, to transmit the transmission signal to an outside, and reflect optical signals input from the outside, the optical signals including the reception signal; and a reflected light-blocking optical filter unit to pass, as the reception signal among the optical signals reflected by the splitter, an optical signal within a preset wavelength range including the second wavelength value.

The present disclosure is generally directed to a holder that can be used to couple to and optically align an optical component with, for instance, an associated light path to launch or receive optical channel wavelengths along the same. The holder preferably includes a receptacle to couple to the optical component and a mounting section enables the holder to be securely coupled to a substrate in a manner that minimizes or otherwise reduces introducing component shift and resulting optical misalignment.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

An optical transceiver comprises a transmitter and a receiver housed in a transistor outline (TO) can. The receiver comprises a first submount comprising at least one waveguide, a photodiode coupled to the first submount and the at least one waveguide, and a transimpedance amplifier (TIA) coupled to the first submount and the at least one waveguide, wherein the at least one waveguide couples the photodiode to the TIA, wherein the at least one waveguide is positioned on the first submount in between the photodiode and the TIA.

An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

An optical module with an improved coupling portion to couple an optical device with an external fiber is disclosed. The coupling portion includes a stub to secure a coupling fiber in a center thereof, a bush to support the stub, a sleeve to receive the stub in a portion thereof and an external ferrule in another portion, and a sleeve cover to cover the sleeve. The coupling portion further includes a latch put between the bush and the cover by being hooked with both the bush and the cover. The latch electrically isolates the bush from the cover even when the bush and the sleeve cover are made of metal.