One embodiment discloses a thermoelectric element comprising: a first substrate; a plurality of thermoelectric legs disposed on the first substrate; a second substrate disposed on the plurality of thermoelectric legs above the first substrate; electrodes including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; and a first reinforcing part disposed on the lower surface and a portion of the side surface of the first substrate.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

An optical transmitter module that generates a signal multiplexing two or more optical signals each having optical power satisfying a preset magnitude is disclosed. The optical transmitter module includes laser diodes (LD), adjusting lenses coupled with the LDs to generate dispersive optical outputs, and a concentrating lens that concentrates the dispersive optical beams onto a coupling fiber. A feature of the optical transmitter module is that the adjusting lenses are set closer to the LDs to adjust the optical power coupled with the coupling fiber.

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

A butterfly-type packaged optical transceiver with multiple transmission and reception channels includes a box-shaped housing, a cover plate, an optical receiving module, an optical emitting module, a polarizing prism module, an optical fiber connector and electrical connection elements. The sealed housing encloses the optical receiving module, the optical emitting module, and the polarizing prism module. Electrical connection elements penetrate both side surfaces of the housing and are in contact with the optical fiber connector and the optical receiving module and the optical emitting module. A first incoming optical signal is transmitted to the optical receiving module via the optical fiber connector, the through hole, and the prism module, and the optical emitting module emits an outgoing second optical signal through the prism module, the through hole, and the optical fiber connector.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

One embodiment discloses a thermoelectric element comprising: a first substrate; a plurality of thermoelectric legs disposed on the first substrate; a second substrate disposed on the plurality of thermoelectric legs above the first substrate; electrodes including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; and a first reinforcing part disposed on the lower surface and a portion of the side surface of the first substrate.

A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.