Coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic having a fibre optic comprising an end portion with a front face, as well as a moulded part made of optically transparent material, wherein the end portion of the fibre optic is arranged in the moulded part and is connected to the moulded part in a positively locking manner. Furthermore, a method for producing a coupler for coupling or decoupling a light signal into or out of a front face of a fibre optic, has the following steps: A) providing a mould with a mould space, B) inserting an end portion of a fibre optic having the front face into the mould space, C) filling the mould space with an optically transparent material in flowable form, D) solidifying the optically transparent material into a moulded part.

An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

Temperature measurements of photonic circuit components may be performed optically, exploiting a temperature-dependent spectral property of the photonic device to be monitored itself, or of a separate optical temperature sensor placed in its vicinity. By facilitating measurements of the temperature of the individual photonic devices rather than merely the photonic circuit at large, such optical temperature measurements can provide more accurate temperature information and help improve thermal design.

A symmetric distributed feedback (DFB) laser that is integrated in a silicon based photonic integrated circuit can output light from both sides of the symmetric DFB laser onto waveguides. The light in the waveguides can be phase adjusted and combined using an optical coupler. The symmetric DFB laser can generate light and symmetrically output light onto different lanes of a multi-lane transmitter.

An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.

An optical assembly includes an optical ferrule configured to receive light from an optical waveguide and including at least four ferrule alignment features; and a cradle securing the optical ferrule therein and configured to align the optical ferrule to an optical component, the cradle including at least four cradle alignment features configured to make contact or near contact with the at least four ferrule alignment features in a one to one correspondence in at least four corresponding contact regions, such that as a temperature of at least one of the cradle and the optical ferrule changes sufficiently, the corresponding alignment features of the optical ferrule and the cradle slide relative to each other causing the corresponding alignment features of the optical ferrule and the cradle to move to define corresponding traversed regions, such that when extended, the traversed regions of the at least four ferrule alignment features and the at least four cradle alignment features pass within 20 microns of a same first point.

An optical waveguide package includes a substrate having a first surface, and an optical waveguide layer including a cladding located on the first surface and a core located in the cladding. The substrate includes a first portion and a second portion being in contact with the cladding. The second portion bonds to the cladding with a higher bonding strength than the first portion.

An optical receptacle includes an optical receptacle main body and a cylindrical fixing member. The optical receptacle main body includes a first optical surface, a second optical surface, and an annular groove disposed to surround a first central axis of the first optical surface or disposed to surround a second central axis of the second optical surface. The fixing member is configured with a material with a smaller linear expansion coefficient than that of the optical receptacle main body, and is fit to the groove so as to be in contact with at least a part of an inner surface of the groove.

An optical module includes an interface electrically connected to an external device to receive a data signal to be transmitted, a signal processor configured to perform serialization and signal modulation on the received data signal, an optical transceiver configured to generate an optical transmission signal by receiving a direct current (DC) light source, in which a plurality of light sources having different wavelengths are multiplexed, from an optical power supply and performing optical modulation thereon through the serialized and modulated data signal, and an optical fiber connector configured to output the generated optical transmission signal to the external device and receive an optical reception signal from the external device.

An optical attenuating structure is provided. The optical attenuating structure includes a substrate, a waveguide, doping regions, an optical attenuating member, and a dielectric layer. The waveguide is extended over the substrate. The doping regions are disposed over the substrate, and include a first doping region, a second doping region opposite to the first doping region and separated from the first doping region by the waveguide, a first electrode extended over the substrate and in the first doping region, and a second electrode extended over the substrate and in the second doping region. The first optical attenuating member is coupled with the waveguide and disposed between the waveguide and the first electrode. The dielectric layer is disposed over the substrate and covers the waveguide, the doping regions and the first optical attenuating member.