Patent classifications
G02B6/4279
OPTICAL MODULE
The invention provides an optical module which is less likely to be damaged, and can be assembled at low cost. The optical module comprises a housing having an electrical signal port for inputting and/or outputting an electrical signal and an optical signal port for inputting and/or outputting an optical signal, a first substrate arranged in the housing so as to connect to the electrical signal port, an optical fiber arranged in the housing so as to connect to the optical signal port, and a second substrate provided with an optical device which connects to the optical fiber to input the optical signal from the optical fiber and output the optical signal to the optical fiber, and arranged in the housing so as to electrically connect to the first substrate, and to be inclined with respect to a base plane of the housing.
Geometric configuration of device for launching tranverse magnetic waves
Disclosed are one or more preferred geometric configurations for a device communicably coupled to a power transmission line and capable of launching transverse electromagnetic waves onto the transmission line. The waves propagate data received from a data source and may include a reflector and a coupler adjacent to each other through a transverse magnetic wave that propagates longitudinally along the surface of the transmission line.
Optical receiver
Disclosed is an optical receiver. The optical receiver includes a circuit board, a base member, a photodetector mounted on the base member, a transimpedance amplifier, and a capacitor. The base member is disposed between a first grounding pattern and a second grounding pattern on a first side of the circuit board. The transimpedance amplifier is mounted on the first grounding pattern. The capacitor is mounted on the second grounding pattern. The first wiring pattern and the second wiring pattern are apart from both the first grounding pattern and the second grounding pattern in a plan view of the first side. The first grounding pattern is electrically connected to the second grounding pattern through a grounding pattern formed on the first side.
Optical module
An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate.
WIRING BASE AND ELECTRONIC DEVICE
In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.
Data-carrying arrester
Disclosed is a signal conductor formed as a metal oxide varistor (MOV), the MOV having a first MOV and a second MOV separated by an insulator. In some embodiments, the disclosed signal conductor may be used in a system communicably coupled to a power transmission distribution network, the system capable of launching transverse electromagnetic waves onto a transmission line, where the electromagnetic waves propagating a data signal conveyed to the system by the MOV.
Active optical cable assemblies
The present disclosure describes active optical cable assemblies. A cable assembly includes a fixed active optical connector having a transceiver, a ruggedized optical fiber cable integrated with the fixed active optical connector, a main cable assembly comprising one or more optical fiber cables, wherein the ruggedized cable is spliced to the main cable assembly; and a removable shroud configured to surround at least a portion of the fixed active optical connector plugged into a remote radio unit and to be secured to a remote radio unit. Active optical cable and remote radio unit systems are also described.
SWITCH ASSEMBLY
An integrated switch assembly having a stacked configuration, the integrated switch assembly comprising: a first layer, the first layer comprising a photonic integrated circuit, PIC; a second layer, the second layer comprising a switch ASIC; wherein the first layer is mounted onto a substrate and the second layer is mounted on top of the first layer.
High Frequency Signal Coupling to Surface Emitters
To reduce crosstalk between bond wires, one illustrative integrated circuit includes an array of photoemitters arranged along a centerline, with adjacent photoemitters having contact pads on opposite sides of the centerline. An illustrative assembly includes an integrated circuit chip having an array of photoemitter contact pads; a printed circuit board having a recess in which the integrated circuit chip is mounted; and bond wires connecting the contact pads with respective contact pads on the printed circuit board. An illustrative cable connector includes a module that optically couples optical fibers to an array of photoemitters on an integrated circuit chip mounted to a printed circuit board. Each photoemitter has contact pads connected to the printed circuit board contact pads by bond wires, the bond wires for each photoemitter being routed in an opposite direction relative to the bond wires for any adjacent photoemitters in the array.
High Frequency Package
A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from the mounting surface.