A beam guide guides a laser beam on a device for extreme ultraviolet lithography. The beam guide has a scraper mirror for coupling out laser radiation and a positioning device for positioning the scraper mirror in a positioning plane defined by first and second positioning axes. The positioning device contains first and second positioning units assigned to the first and second positioning axes, respectively. The first positioning unit has a first linear guide and a first positioning drive. By the first positioning drive, the scraper mirror is moved together with the mirror-side guide element of the first linear guide relative to the mirror-remote guide element of the first linear guide along the first positioning axis into a target position. The second positioning unit has a second linear guide and a second positioning drive, the second linear guide has a mirror-side guide element and a mirror-remote guide element.

A projection exposure apparatus for semiconductor lithography comprises an optical element and a temperature recording device for detecting a temperature on a surface of the optical element via electromagnetic radiation emanating from the surface of the optical element. The temperature recording device can comprise a filter for filtering the electromagnetic radiation.

The present specification discloses a mirror assembly having an image viewing surface which resists fogging caused by condensation of water vapor on the viewing surface and a fogless mirror system comprising such a mirror assembly and an attachment system as well as methods and uses for such mirror assembly and fogless mirror system.

A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.

An excess heat-generating element is coupled to a heat sink through a heat conduction path. A thermal switch is mounted in the heat conduction path. A temperature-sensitive element is coupled to the heat conduction path on a same side of the thermal switch as the excess heat-generating element. A temperature monitor is mounted adjacent the temperature-sensitive element. A temperature controller has an input coupled to the temperature output of the temperature monitor and an output control line coupled to an input of the thermal switch. The temperature controller switches off the thermal switch, in response to detecting a temperature below a temperature threshold from the temperature output. When the thermal switch it off, it impedes heat flow from the excess heat-generating element to the heat sink, and the heat flow is redirected to increase heat flow from the excess heat-generating element to the heat-sensitive element.

A thermally actuated adaptive optic includes a base, a reflector, and a plurality of actuators coupled therebetween. The reflector has a light-receiving front surface, and a back surface facing the base. Each actuator includes a bracket rigidly bonded to the reflector at a perimeter of the reflector, and an inner rod and an outer rod. Each rod is rigidly connected between the bracket and the base, with the inner rod being closer to a center of the reflector. The length of each rod is temperature dependent. In another adaptive optic, the rods are instead bonded directly to the reflector. This adaptive optic may be modified to implement an integrally formed, thermally actuated support. The disclosed adaptive optics are suitable for use in laser systems, allow for significant cost savings over piezoelectric devices, provide a reflective area free of surface-figure perturbations caused by the actuator-interfaces, and are relatively simple to manufacture.

An optical element and a lithographic apparatus including the optical element. The optical element includes a first member having a curved optical surface and a heat transfer surface, and a second member that comprises at least one recess, the at least one recess sealed against the heat transfer surface to form at least one closed channel between the first member and the second member to allow fluid to flow therethrough for thermal conditioning of the curved optical surface. In an embodiment, one or more regions of the heat transfer surface exposed to the at least one closed channel are positioned along a curved profile similar to that of the curved optical surface.

An EUV collector mirror for an extreme ultra violet (EUV) radiation source apparatus includes an EUV collector mirror body on which a reflective layer as a reflective surface is disposed, a heater attached to or embedded in the EUV collector mirror body and a drain structure to drain melted metal from the reflective surface of the EUV collector mirror body to a back side of the EUV collector mirror body.

In accordance with some embodiments, a lithography method in semiconductor manufacturing is provided. The lithography method includes transmitting a main pulse laser to a zone of excitation through a first optic assembly. The lithography method further includes supplying a coolant to the first optic assembly and detecting a temperature of the coolant with a use of at least one sensor. The lithography method also includes adjusting a heat transfer rate between the coolant and the first optic assembly based on the temperature of the first optic assembly. In addition, the lithography method includes generating a droplet of a target material into the zone of excitation. The lithography method further includes exciting the droplet of the target material into plasma with the main pulse laser in the zone of excitation.

A cooling sub-assembly for cooling a heat dissipating electronic device. The sub-assembly may include a vapor chamber, a peltier element and a coldplate placed on top of each other forming a stack such that the peltier element is sandwiched between the vapor chamber and the coldplate. The vapor chamber has a head facing the peltier element, a foot for facing the heat dissipating electronic device, and a wall extending between the foot and the head. The area of the head is larger than the area of the foot.