A conductive film includes a support, detection electrodes that are arranged on at least one main surface of the support, connection portions that are arranged on the main surface so as to be electrically connected to an external terminal, and lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof, in which the connection portions contain a binder and a metal component, and a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

A conductive film includes a support, detection electrodes that are arranged on at least one main surface of the support, connection portions that are arranged on the main surface so as to be electrically connected to an external terminal, and lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof, in which the connection portions contain a binder and a metal component, and a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

A conductive film includes a support, detection electrodes that are arranged on at least one main surface of the support, connection portions that are arranged on the main surface so as to be electrically connected to an external terminal, and lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof, in which the connection portions contain a hinder and a metal component, and a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

A conductive film includes a support, detection electrodes that are arranged on at least one main surface of the support, connection portions that are arranged on the main surface so as to be electrically connected to an external terminal, and lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof, in which the connection portions contain a hinder and a metal component, and a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

A manufacturing method for a conductive substrate having a conductive thin wire with a thin line width and excellent conductivity in which the intersection growing is suppressed. The manufacturing method includes a step of forming a mesh-shaped underlying silver pattern on a side of one surface of a base material by a photographic method, a step of disposing a resist film on the side of the surface of the base material on which the underlying silver pattern is formed, a step of exposing the resist film by irradiation of light from a side of a surface of the base material on which the underlying silver pattern is not formed, a step of developing the exposed resist film to form a resist pattern, and a step of performing a plating treatment using the underlying silver pattern as a seed layer to form a metal pattern on the underlying silver pattern.