The present invention relates to a method for manufacturing a flexible photo-patterned mask. The method includes a) coating a photoresist composition on a substrate to form a photoresist film, b) exposing the photoresist film to pattern the photoresist film, c) developing the patterned photoresist film, and d) curing the developed photoresist film to form a patterned layer having a plurality of tapered openings.

A photosensitive material includes: a compound A having a carboxy group, in which the compound A includes a polymer including a repeating unit derived from (meth)acrylic acid, and a content of the carboxy group in a photosensitive layer which is formed from the photosensitive material is reduced by irradiation with an actinic ray or a radiation.

A method of manufacturing a display device in a chamber in which a material including yttrium is coated on an inner surface includes: forming a first layer pattern by dry etching on a substrate; depositing a second layer material on the first layer pattern; forming a photoresist pattern on the second layer material; completing a second layer pattern by using the photoresist pattern as an etch mask; and performing an additional acid etching process by using an etching solution including at least one of hydrochloric acid, sulfuric acid, or nitric acid before the forming of the photoresist pattern on the second layer material after the dry etching to form the first layer pattern.

Gray-tone lithography techniques for controlling the thickness profile of an overcoat layer on a surface-relief grating that has a non-uniform grating parameter (e.g., depth, duty cycle, or period), compensating for the non-uniform etch rate in a large area, defining etch/block regions, and/or controlling the thickness of the grating layer.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition capable of obtaining a pattern having a good shape, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a salt including a cation represented by Formula (X) and a resin of which polarity increases through decomposition by the action of an acid.

##STR00001##

A method of processing a substrate includes: providing structures on a surface of a substrate; depositing a self-assembled monolayer (SAM) over the structures and the substrate, the SAM being reactive to a predetermined wavelength of radiation; determining a first pattern of radiation exposure, the first pattern of radiation exposure having a spatially variable radiation intensity across the surface of the substrate and the structures; exposing the SAM to radiation according to the first pattern of radiation exposure, the SAM being configured to react with the radiation; developing the SAM with a predetermined removal fluid to remove portions of the SAM that are not protected from the predetermined fluid; and depositing a spacer material on the substrate and the structures, the spacer material being deposited at varying thicknesses based on an amount of the SAM remaining on the surface of the substrate and the structures.

A mask and a method of manufacturing the same, an evaporation apparatus and a display device are provided. The method includes forming a first photoresist pattern on a substrate, the first photoresist pattern including a plurality of photoresist structures, each photoresist structure including a first surface away from the substrate and a second surface near the substrate, and the size of the first surface being smaller than that of the second surface; forming a metal layer on the substrate with the first photoresist pattern, the metal layer including a plurality of recessed regions and a plurality of raised regions; forming a second photoresist pattern in the recessed regions, an orthographic projection of the second photoresist pattern on the metal layer overlapping with the recessed regions; removing regions of the metal layer not covered by the second photoresist pattern, the second photoresist pattern, the substrate and the first photoresist pattern mask.

Provided are a conductive member for a touch panel and a manufacturing method thereof, the conductive member having a conductive layer including an opaque conductive material on a flexible transparent insulating substrate, such that damage of the conductive layer is prevented. The manufacturing method of the conductive member including a first conductive layer, an interlayer insulating layer, and a second conductive layer in this order on the flexible substrate, includes: 1) forming the first conductive layer on the substrate; 2) ef-forming the interlayer insulating layer; and 3) forming the second conductive layer, in which each of the steps 1 and 3 includes forming a fine metal wire using a photolithography method, a thickness of the interlayer insulating layer is 1 to 5 .Math.m, and the bend resistance obtained by measuring the conductive member using a cylindrical mandrel method according to JIS-K5600-5-1 is less than 5 mm.

A hardmask composition, a hardmask layer manufactured from the hardmask composition, and a method of forming patterns from the hardmask composition, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1,

##STR00001##

A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid. A removal capacity for the processing film to remove the first removal target present in the second region is higher than a removal capacity for the preprocessing film to remove the first removal target present in the second region, and a removal capacity for the preprocessing film to remove the first removal target present in the first region is higher than a removal capacity for the processing film to remove the first removal target present in the first region.