An organic EL display device including a substrate, and a planarization layer, a first electrode, a pixel division layer, a light emitting pixel and a second electrode formed on the substrate, wherein the planarization layer and/or the pixel division layer contain(s) zirconium nitride particles, and a crystallite size of the zirconium nitride particles determined from a half width of a peak derived from a (111) plane in an X-ray diffraction spectrum using a CuKα ray as an X-ray source is 5 nm or more 20 nm or less. Provided are an organic EL display device with excellent visibility and fewer display defects, and a cured film which is excellent in storage stability of a photosensitive resin composition capable of being applied on an insulating layer of the organic EL display device, and which has high sensitivity and high visible light-shielding property and is also free from residue in the opening.

Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): ##STR00001##
wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X.sup.1 to X.sup.3 represent any of —CO.sub.2—, —CONR.sup.X1—, —O—, —NR.sup.X1—, —S—, —SO.sub.2—, —SO.sub.3— and —SO.sub.2NR.sup.X1— and may be the same as or different from each other, provided that R.sup.X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L.sup.1 and L.sup.2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.

The present invention relates to: a photosensitive transfer material including a temporary support and a photosensitive layer containing a binder polymer, a polymerizable compound, a photopolymerization initiator, and a compound A, in which a number of hydrophilic groups in the compound A being decreased by an action of light or heat, and the photosensitive layer is transferred to a surface of a metal-containing layer; a method of producing the photosensitive transfer material; a film; a touch panel; a method of suppressing deterioration; a laminate; and a method of producing the film.

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

The present invention provides a photosensitive composition which can suppress the generation of a development residue on the surface of an electrode and the corrosion of the electrode to form a black pixel division layer, and also can suppress the generation of off-pixel in an organic EL display device comprising the pixel division layer. Disclosed is a photosensitive composition comprising (a) a pigment, (b) a resin having two or more tertiary amino groups in the molecule, and (c) a photosensitive agent, wherein the component (b) contains a resin having a structure represented by the general formula (1).

A liquid ejection head includes a substrate having a liquid feeding port and an energy generating element, a substrate protective layer provided on the substrate, and a nozzle forming member provided on the substrate protective layer, and having an ejection port ejecting a liquid, and a liquid flow channel communicating with the liquid feeding port and the ejection port. The substrate protective layer comprises an ion scavenger.

Provided are: a negative photosensitive resin composition with which high resolution properties are exhibited when a relief pattern is formed on copper wiring, imidization adequately progresses even when the curing temperature is low, and a cured relief pattern having good adhesion to copper wiring can be manufactured; and a method for manufacturing a cured relief pattern using the negative photosensitive resin composition. This negative photosensitive resin composition contains (A) a polyimide precursor including specific structural units which are represented by general formula (1) and which have a univalent organic group having a urea structure, and (B) a photopolymerization initiator.

A photosensitive resin composition including a polyamide-imide resin having a specific structure, a film comprising a cured product of the photosensitive resin composition, a method for preparing the film and a method for forming a resist pattern using the photosensitive resin composition.

A negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that is soluble in an alkaline aqueous solution, enables formation of a fine pattern, can achieve high resolution, and has excellent mechanical characteristics such as rupture elongation and tensile strength even when cured at low temperatures.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).