Patent classifications
G03F7/3007
A NOVEL SYSTEM FOR REDUCING ABLATION DEBRIS
A system for exposing a heat and/or light sensitive printing plate precursor including a coating on a support includes a platesetter including a laser head for generating a laser beam to create an image, and the platesetter further includes an electrostatic generator capable of electrostatically charging the surface of the coating.
Anisotropic etching of metallic substrates
In some examples, a method includes forming a photoresist layer on a surface of a metallic substrate and developing the photoresist layer to define a pattern exposing a portion of the surface of the metallic substrate. The method also may include forming an electrically conductive layer on a surface of the photoresist layer and the exposed portions of the surface of the metallic substrate. The electrically conductive layer contacts the exposed portions of the surface of the metallic substrate. The method may further include submerging the substrate, the photoresist layer, and the electrically conductive layer in an electrolyte solution; and applying a voltage to between a cathode and an anode submerged in the electrolyte solution to anisotropically etch the metallic substrate where the electrically conductive layer contacts the exposed portions of the surface of the metallic substrate to form at least one feature in the metallic substrate.
RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD
A radiation-sensitive composition contains: a metal oxide having a first structural unit represented by formula (1), formula (2) or a combination thereof, and a second structural unit represented by formula (3); and a solvent. In the formulae (1) to (3), M.sup.1, M.sup.2 and M.sup.3 each independently represent germanium, tin or lead; and R.sup.1, R.sup.2 and R.sup.3 each independently represent a monovalent organic group having 1 to 40 carbon atoms which bonds to M.sup.1 or M.sup.2 via a carbon atom. A proportion of the first structural unit with respect to total structural units constituting the metal oxide is preferably no less than 50 mol %.
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RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD
A radiation-sensitive composition contains: a metal oxide having a first structural unit represented by formula (1), formula (2) or a combination thereof, and a second structural unit represented by formula (3); and a solvent. In the formulae (1) to (3), M.sup.1, M.sup.2 and M.sup.3 each independently represent germanium, tin or lead; and R.sup.1, R.sup.2 and R.sup.3 each independently represent a monovalent organic group having 1 to 40 carbon atoms which bonds to M.sup.1 or M.sup.2 via a carbon atom. A proportion of the first structural unit with respect to total structural units constituting the metal oxide is preferably no less than 50 mol %.
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System for reducing ablation debris
A system for exposing a heat and/or light sensitive printing plate precursor including a coating on a support includes a platesetter including a laser head for generating a laser beam to create an image, and the platesetter further includes an electrostatic generator capable of electrostatically charging the surface of the coating.
Treatment solution supply method, treatment solution supply apparatus, and non-transitory computer-readable recording medium
A treatment solution supply method of supplying a treatment solution to a substrate, the method includes the steps of: applying a DC voltage to the treatment solution; detecting a potential difference between two points in the treatment solution in a state where the DC voltage is applied to the treatment solution; and increasing the DC voltage when the detected potential difference is less than a predetermined reference value.
Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake
Methods disclosed herein provide apparatus and methods for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber configured to apply an electric field to a substrate via a non-gas phase intermediate medium. Methods described herein include dissociation of a photoacid generator to generate anions and cations. The anions may be moved within the photoresist layer by the electric field to more precisely control the speed and location of acid generation and regeneration processes.
RESIST SENSITIVITY AND PROFILE IMPROVEMENT VIA ACID ANION CONTROL DURING FIELD-GUIDED POST EXPOSURE BAKE
Methods disclosed herein provide apparatus and methods for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber configured to apply an electric field to a substrate via a non-gas phase intermediate medium. Methods described herein include dissociation of a photoacid generator to generate anions and cations. The anions may be moved within the photoresist layer by the electric field to more precisely control the speed and location of acid generation and regeneration processes.