Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes: a first process chamber having a first treating space therein; a second process chamber having a second treating space therein; and an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space, in which the exhaust unit includes an integrated exhaust line in which a pressure reduction unit is installed, a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the first process chamber and a second point of the integrated exhaust line, and an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber.

A processing system for processing a photosensitive flexographic printing plate having an aqueous-processable photopolymer. A main processing unit is used to develop a relief image by removing unexposed photopolymer using an aqueous processing solution including a first dispersing agent while the photosensitive flexographic printing plate is being subjected to mechanical cleaning. Used aqueous processing solution containing the removed photopolymer is returned back into a processing solution tank. A secondary processing unit is used to wash the developed relief image with secondary aqueous processing solution including a second dispersing agent to remove debris from the developed relief image. Used secondary aqueous processing solution containing the removed photopolymer is directed into the processing solution tank. A portion of the aqueous processing solution from the processing solution tank is removed to keep a volume of aqueous processing solution in the processing solution tank below a predefined maximum volume.

A method for processing a photosensitive flexographic printing plate having an aqueous-processable photopolymer. A main processing unit is used to develop a relief image by removing unexposed photopolymer using an aqueous processing solution including a first dispersing agent while the photosensitive flexographic printing plate is being subjected to mechanical cleaning. Used aqueous processing solution containing the removed photopolymer is returned back into a processing solution tank. A secondary processing unit is used to wash the developed relief image with secondary aqueous processing solution including a second dispersing agent to remove debris from the developed relief image. Used secondary aqueous processing solution containing the removed photopolymer is directed into the processing solution tank. A portion of the aqueous processing solution from the processing solution tank is removed to keep a volume of aqueous processing solution in the processing solution tank below a predefined maximum volume.

The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a first process chamber having a first treatment space therein; a second process chamber having a second treatment space therein; and an exhaust unit exhausting atmospheres of the first treatment space and the second treatment space, in which the exhaust unit includes: an integrated exhaust line; a first exhaust line connecting the first process chamber and the integrated exhaust line; a second exhaust line connecting the second process chamber and the integrated exhaust line; and a partition wall partitioning a partial section of a flow path within the integrated exhaust line into a first flow path through which a fluid exhausted through the first exhaust line flows and a second flow path through which a fluid discharged through the second exhaust line flows.

A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.

A process for producing a flexographic relief printing plate includes using a photopolymer developing solution. This photopolymer developing solution may comprise butylal alone or butylal and one or more organic cosolvents. It may comprise DPnB and one or more cosolvents and no butylal.

There are provided a developer management method, a developer management device, a plate-making method, and a plate-making apparatus that can prevent development residues from being adhered, can perform appropriate development, and decrease the replacement frequency of a developer. A plate-making method has a developing step of removing and developing a non-exposed portion of an imagewise exposed flexographic printing plate precursor using a developer, a measuring step of measuring a conductivity of the developer used in removing the non-exposed portion of the imagewise exposed flexographic printing plate precursor, and a replenishing step of replenishing at least one liquid of a development replenishing liquid or water to the developer based on the conductivity measured in the measuring step such that the conductivity becomes a conductivity in a determined range.

In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.

A development method includes: a development step of supplying a developing solution to a surface of a substrate for manufacturing a semiconductor device after undergoing formation of a resist film and exposure, to perform development; a first rotation step of, after the development step, increasing revolution speed of the substrate to rotate the substrate in a first rotational direction around a central axis so as to spin off and remove part of the developing solution from the substrate; and a second rotation step of, after the first rotation step, rotating the substrate in a second rotational direction reverse to the first rotational direction so as to spin off and remove the developing solution remaining on the substrate from the substrate.

A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.