A lithography system includes an illumination source including two illumination poles separated along a first direction and symmetrically distributed around an optical axis, a pattern mask to receive illumination from the illumination source, and a set of projection optics to generate an image corresponding to the pattern mask onto a sample. The pattern mask includes a metrology target pattern mask and device pattern mask elements. The device pattern mask elements are distributed along the first direction with a device separation distance. The metrology target pattern mask includes a set of metrology target pattern mask elements having a diffraction pattern corresponding to that of the device pattern mask elements. A metrology target generated on the sample associated with the metrology target pattern mask is characterizable along a second direction and has printing characteristics corresponding to those of device pattern elements generated on the sample associated with the device pattern mask elements.

An actuator to displace, for example a mirror, provides movement with at least two degrees of freedom by varying the currents in two electromagnets. A moving part includes a permanent magnet with a magnetic face constrained to move over a working area lying substantially in a first plane perpendicular to a direction of magnetization of the magnet. The electromagnets have pole faces lying substantially in a second plane closely parallel to the first plane, each pole face substantially filling a quadrant of the area traversed by the face of the moving magnet. An optical position sensor may direct a beam of radiation at the moving magnet through a central space between the electromagnets. The sizes of facets in a pupil mirror device may be made smaller in a peripheral region, but larger in a central region, thereby relaxing focusing requirements.

A pattern of features of an integrated circuit is provided. A configuration of a pupil of an extreme ultraviolet wavelength radiation beam (also referred to as an illumination mode), is selected. The selected configuration is an asymmetric, single pole configuration. At least one disparity is determined between a simulated imaging using the selected configuration and a designed imaging for the pattern of features. A parameter (also referred to as a compensation parameter) is then modified to address the at least one disparity, wherein the parameter at least one a design feature, a mask feature, and a lithography process parameter. A substrate is then exposed to the pattern of features using the selected configuration and the modified parameter.

A microlithographic apparatus includes an objective that includes a transmission filter that is configured to variably modify a light irradiance distribution in a projection light path. The transmission filter includes a plurality of gas outlet apertures that are configured to emit gas flows that pass through a space through which projection light propagates during operation of the microlithographic apparatus. The transmission filter further includes a control unit which is configured to vary a number density of ozone molecules in the gas flows individually for each gas flow. In this manner it is possible to finally adjust the transmittance distribution of the transmission filter.

The invention relates to an optical system of a microlithographic projection exposure apparatus, in particular for operation in the EUV, comprising at least one polarization-influencing arrangement having a first reflection surface and a second reflection surface, wherein the first reflection surface and the second reflection surface are arranged at an angle of 0°±10° or at an angle of 90°±10° relative to one another, wherein light incident on the first reflection surface during the operation of the optical system forms an angle of 45°±5° with the first reflection surface, and wherein the polarization-influencing arrangement is rotatable about a rotation axis running parallel to the light propagation direction of light incident on the first reflection surface during the operation of the optical system.

An illumination system includes a light source used to generate a light and an opaque plate. The opaque plate is disposed between the light source and a photomask and includes an annular aperture and an aperture dipole. The annular aperture has an inner side and an outer side. The aperture dipole includes at least one first aperture and at least one second aperture. The first aperture and the second aperture connected to the annular aperture respectively and protruding out from the outer side of the annular aperture are disposed symmetrically with respect to a center of the annular aperture.

A data tuning software application platform relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed in which the application processes graphical objects and configures the graphical objects for partition into a plurality of trapezoids. The trapezoids may be selectively merged in order to minimize the trapezoid count while limiting the loss of edge fidelity.

An illumination optical system that illuminates a target surface includes a first deflector, a second deflector, and an optical integrator. The first deflector is arranged on a first face crossing an optical path of light from a light source and has a period in a first direction defined on the first face. The second deflector is arranged on a second face crossing an optical path of light from the first deflector and has a period in a second direction defined on the second face. The optical integrator has a plurality of wavefront division facets arrayed on a third face crossing an optical axis of light from the second deflector. At least one of the first and second deflectors rotates about an optical axis of the illumination optical system or about an axis parallel to the optical axis in order to adjust a pattern of an illumination distribution.

A process of an extreme ultraviolet lithography is disclosed. The process includes receiving an extreme ultraviolet (EUV) mask, an EUV radiation source and an illuminator. The process also includes exposing the EUV mask by a radiation, originating from the EUV radiation source and directed by the illuminator, with a less-than-three-degree chief ray angle of incidence at the object side (CRAO). The process further includes removing most of the non-diffracted light and collecting and directing the diffracted light and the not removed non-diffracted light by a projection optics box (POB) to expose a target.

A method for reducing M3D effects on imaging is described. The method includes identifying points within a source plane of the photolithography system that are associated with pattern shifts resulting from diffraction of light off a photomask under an angle of incidence between an imaging beam of radiation and the mask normal, determining pattern shifts associated with the identified source plane points, and modifying the source to reduce the determined pattern shifts.