Provided is a method of forming an amorphous titanium dioxide (TiO.sub.2) thin film on a substrate using a low temperature atomic layer deposition method, the method of forming an amorphous TiO.sub.2 thin film including supplying a titanium (Ti) precursor to the substrate provided in a process chamber to adsorb the Ti precursor on the substrate, forming a Ti precursor film on the substrate by exposing the Ti precursor to the substrate where the Ti precursor is not adsorbed, supplying an oxygen (O.sub.2) precursor to the Ti precursor film and reacting the O.sub.2 precursor with the Ti precursor film, and forming the TiO.sub.2 thin film on the substrate by exposing the O.sub.2 precursor to the Ti precursor film that has not reacted with the O.sub.2 precursor, and reacting the Ti precursor film with the O.sub.2 precursor.

In an aspect, a method for making a metal-containing material comprises steps of: forming a metal-containing hydrogel from an aqueous precursor mixture using a photopolymerization; wherein the aqueous precursor mixture comprises water, one or more aqueous photosensitive binders, and one or more aqueous metal salts; and thermally treating the metal-containing hydrogel to form the metal-containing material; wherein the metal-containing hydrogel is exposed to a thermal-treatment atmosphere during the step of thermally treating; wherein a composition of the metal-containing material is at least partially determined by a composition of the thermal-treatment atmosphere during the thermally treating step.

The invention relates to a device for measuring a substrate for semiconductor lithography, comprising an illumination optical unit, an imaging optical unit and a recording device arranged in the image plane of the imaging optical unit, a diffractive element being arranged in the pupil of the imaging optical unit.

The invention also relates to a method for measuring a substrate for semiconductor lithography with a measuring device, the measuring device comprising an imaging optical unit with a pupil, with the following method steps: arranging a diffractive element in the pupil of the imaging optical unit for producing a multifocal imaging, capturing the imaging of a partial region of the substrate, and evaluating the imaging.

A two-photon-polymerization laser direct writing system based on an acousto-optic deflector is provided, which includes an ultrafast laser device, a beam expander, a scanning field center angular dispersion compensator, a two-dimensional acousto-optic deflector, a scanning field edge angular dispersion compensator, an astigmatism compensator and a focusing objective lens, the ultrafast laser device is configured to emit an ultrafast laser; the scanning field center angular dispersion compensator is configured to conduct precompensation on an angular dispersion at a center of a scanning field; the two-dimensional acousto-optic deflector is configured to deflect the ultrafast laser on the angular dispersion at the center of the scanning field; the scanning field edge angular dispersion compensator is configured to compensate for an angular dispersion at an edge of the scanning field; the astigmatism compensator is configured to compensate for astigmatism; the focusing objective lens is configured to conduct tight-focusing on the ultrafast laser.

A method and composition for enabling indirect photoexcitation whereby a large energy gap between energy levels in a second material is circumvented by a series of lower energy photoexcitations in a first material.

A method of producing a test body for diffusion tensor imaging, which comprises a plurality of channels in a structuring material, the channels preferably having a maximum cross-section of 625 μm.sup.2, wherein a virtual model of the test body is created and the virtual model is fed to a structuring device which produces the test body by means of a 3D printing-based, in particular lithography-based, structuring process, the structuring process being designed as a multiphoton lithography process, in particular as a multiphoton absorption process, in which the structuring material containing a photosensitizer or photoinitiator is irradiated in a location-selective manner, wherein the radiation is successively focused on focal points lying within the structuring material, resulting in that in each case a volume element of the material located in the focal point is subjected to a change in state by means of a photochemical reaction as a result of multiphoton absorption.

Systems and methods are described herein for electron-beam lithography. In some aspects, a photo electron emitter and channel array assembly (PEECAA) may include a photo-electron emitting cathode having a uniform planar surface and an array of beam channels proximate to the cathode. In some cases, at least one of the cathode or the array of beam channels is removable from the PEECAA. The array of beam channels may include a grid of apertures, a plurality of beam channels, and a shared lens array including a plurality of lenses proximate to an exit of the plurality of beam channels. Individual apertures of the grid of apertures align with individual beam channels to allow electrons from the cathode to pass through the array of beam channels and the shared lens array to form a pixelated pattern, such that, upon exposure to the target, the pixelated pattern is permanently formed on the target.

A method of making a three-dimensional structure including substructures is provided. The method includes directing laser light from a microscope objective through a photopolymerizable material to form a plurality of substructures each having at least one vertical wall directly attached to a vertical wall of an adjacent substructure. The substructures are individually formed in a sequence such that any second substructure that is formed in a location vertically disposed between the microscope objective and a first substructure has a wall that extends horizontally a shorter distance than a wall of the first substructure if a third substructure will subsequently be formed directly attached to the wall of the first substructure. The method is useful for minimizing passing laser light through a portion of an already formed substructure during formation of the three-dimensional structure.

Probe structures, probe arrays, have varying intrinsic material properties along their lengths. Methods of forming probes and probe arrays comprise varying the plating parameters to provide varying intrinsic material properties. Some embodiments provide deposition templates created using multiphoton lithography to provide probes with varying lateral configurations along at least portion of their lengths.

The present invention concerns an optical system for spatiotemporally shaping the wavefront of the electric field of a light beam (1) to be projected into a target volume (5), where the propagation axis is axis z, to create 3D patterned illumination in the target volume (5), comprising a pulsed laser source, configured to have an illumination pattern whose transversal surface at the target volume being superior to the diffraction limit of the optical system, at least one intermediate optical element (4) which is a dispersive grating for performing temporal focusing of the light beam (1), located, on the propagation axis (z), where an image of the illumination pattern is formed, for modulating the phase and/or the amplitude of the electric field of the light beam, and a second optical element (3) which is a spatiallight modulator for modulating the phase of the electric field of the input light beam, and for realizing spatiotemporal multiplexing to create 3D patterned illumination in the target volume (5) by replicating the illumination pattern, so as to have several replicated illumination patterns in the target volume (5), and controlling the position with transversal coordinates X, Y and axial coordinate Z of each replicated illumination pattern in the target volume (5).