The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.

The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.

A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.

Apparatus and methods of performing nanoimprint lithography using an anti-slip landing ring are provided. In one embodiment, a process chamber for nanoimprint lithography is provided and includes a substrate support and a ring disposed on the substrate support. The ring has a top surface opposite the substrate support, and the top surface has a grid pattern. A bottom surface facing the substrate support has a different pattern compared to the grid pattern.

An imprint apparatus comprises a mold holder configured to move while holding the mold, and a substrate holder including a plurality of suction regions for chucking the substrate and configured to move while holding the substrate. When performing the mold separation, among the plurality of suction regions, a suction force of a suction region at a position where the mold is to be separated from the imprint material is made weaker than a suction force of a suction region on a peripheral side of the substrate than the position where the mold is to be separated, and the mold holder is tilted after at least one of the mold holder and the substrate holder is moved by a predetermined amount so as to widen a gap between the mold and the substrate.

An apparatus for processing a substrate in a vacuum chamber is described. The apparatus includes a first carrier transport system for transporting a first carrier along a first transport path in a first direction and a second carrier transport system for transporting a second carrier along a second transport path in the first direction. Further, the apparatus includes a measurement system for measuring a distance between the first carrier and the second carrier. The distance is perpendicular to the first direction.

Apparatus and methods of performing nanoimprint lithography using an anti-slip landing ring are provided. In one embodiment, a process chamber for nanoimprint lithography is provided and includes a substrate support and a ring disposed on the substrate support. The ring has a top surface opposite the substrate support, and the top surface has a grid pattern. A bottom surface facing the substrate support has a different pattern compared to the grid pattern.

A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact with each other is cured. The method includes a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured, and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.

A method comprising contact-free positioning a template mask wafer having a template device pattern relative to a predetermined surface area section of a device pattern wafer. The template mask wafer includes a semitransparent layer. The method includes contact-free aligning one or more mask alignment marks of the template mask wafer with one or more alignment marks of the device pattern wafer and contacting the mask wafer on the device pattern wafer. The method includes transferring a template device pattern of the template mask wafer onto the predetermined surface area section of the device pattern wafer using an electron beam while heat conduction is distributed throughout the mask wafer to maintain a low temperature rise in the mask wafer during the transferring. A system is also provided.

A method comprising contact-free positioning a template mask wafer having a template device pattern relative to a predetermined surface area section of a device pattern wafer. The template mask wafer includes a semitransparent layer. The method includes contact-free aligning one or more mask alignment marks of the template mask wafer with one or more alignment marks of the device pattern wafer and contacting the mask wafer on the device pattern wafer. The method includes transferring a template device pattern of the template mask wafer onto the predetermined surface area section of the device pattern wafer using an electron beam while heat conduction is distributed throughout the mask wafer to maintain a low temperature rise in the mask wafer during the transferring. A system is also provided.