A semiconductor fabrication facility (FAB) is provided. The FAB includes a number of processing tools. The FAB also includes a sampling station connected to the processing tools. In addition, the FAB includes a detection vehicle detachably connected to the sampling station and comprising a metrology module. When the detection vehicle is connected to the sampling station, a gas sample is delivered from one of the processing tools to the metrology module of the detection vehicle via the sampling station for performing a measurement of a parameter in related to the gas sample by the metrology module. In addition, the FAB includes a control system configured to issue a warning when the parameter in related to the gas sample from the one of the processing tools is out of a range of acceptable values associated with the one of the processing tools.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a number of processing tools. The FAB also includes a sampling station connected to the processing tools. In addition, the FAB includes a detection vehicle detachably connected to the sampling station and comprising a metrology module. When the detection vehicle is connected to the sampling station, a gas sample is delivered from one of the processing tools to the metrology module of the detection vehicle via the sampling station for performing a measurement of a parameter in related to the gas sample by the metrology module. In addition, the FAB includes a control system configured to issue a warning when the parameter in related to the gas sample from the one of the processing tools is out of a range of acceptable values associated with the one of the processing tools.

The present invention makes it possible to convert an NC program used for one processing into an NC program capable of securing appropriate processing accuracy in another processing machine. Provided is an NC program conversion process method by a conversion system which converts a conversion source NC program for executing a processing in a conversion source processing machine into a conversion destination NC program for executing a processing in a conversion destination processing machine, wherein an input of information relating to (1) stiffness of the conversion destination processing machine or (2) stiffness of the tool included in a conversion destination toolset is received, and on the basis of the received information relating to the stiffness, a conversion source NC program 1424 is converted into a conversion destination NC program 1425.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

The present invention makes it possible to convert an NC program used for one processing into an NC program capable of securing appropriate processing accuracy in another processing machine. Provided is an NC program conversion process method by a conversion system which converts a conversion source NC program for executing a processing in a conversion source processing machine into a conversion destination NC program for executing a processing in a conversion destination processing machine, wherein an input of information relating to (1) stiffness of the conversion destination processing machine or (2) stiffness of the tool included in a conversion destination toolset is received, and on the basis of the received information relating to the stiffness, a conversion source NC program 1424 is converted into a conversion destination NC program 1425.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

The present invention makes it possible to convert an NC program used for one processing into an NC program capable of securing appropriate processing accuracy in another processing machine. Provided is an NC program conversion process method by a conversion system which converts a conversion source NC program for executing a processing in a conversion source processing machine into a conversion destination NC program for executing a processing in a conversion destination processing machine, wherein an input of information relating to (1) stiffness of the conversion destination processing machine or (2) stiffness of the tool included in a conversion destination toolset is received, and on the basis of the received information relating to the stiffness, a conversion source NC program 1424 is converted into a conversion destination NC program 1425.

Systems and methods are provided for creating three dimensional (3D) visualizations of in-process products. One embodiment is an apparatus that includes a controller and an interface. The controller is able to generate a 3D scene depicting ongoing assembly of a product by a machine tool. The scene includes a 3D model of the product and a 3D model of the machine tool, and the 3D models are placed within the scene based on a location of the product and a location of the machine tool. The interface is able to receive an update from the machine tool indicating a 3D placement of a part that has been attached by the machine tool to the product. The controller is also able to acquire a 3D model of the part, to insert the 3D model of the part within the scene based on the 3D placement, and to provide the scene for display to a user.

The present invention makes it possible to convert an NC program used for one processing into an NC program capable of securing appropriate processing accuracy in another processing machine. Provided is an NC program conversion process method by a conversion system which converts a conversion source NC program for executing a processing in a conversion source processing machine into a conversion destination NC program for executing a processing in a conversion destination processing machine, wherein an input of information relating to (1) stiffness of the conversion destination processing machine or (2) stiffness of the tool included in a conversion destination toolset is received, and on the basis of the received information relating to the stiffness, a conversion source NC program 1424 is converted into a conversion destination NC program 1425.

A method for configuring a clean room (2) for the manufacture of pharmaceutical products and the manufacture of pharmaceutical products includes the steps: selecting a pharmaceutical product for the manufacture in the clean room (2); determining one or a plurality of specific devices (16) and/or one or a plurality of specific materials (18) for the manufacture of the selected pharmaceutical product; and assigning locations for the particular, respectively specific devices (16) and/or specific materials (18) in the clean room (2) and, that is, by using a navigation system (4). The navigation system (4) issues at least one notification (6, 8, 10, 12, 14) associated with a location in the clean room (2) indicating where the specific device (16) and/or the specific material (18) for the manufacture of the selected pharmaceutical product is/are to be placed.