A method for correcting a robot is provided. The method includes: providing a correction device, wherein the correction device comprises a jig wafer; grabbing and/or transferring the jig wafer by using the robot to obtain collected data; determining, based on the collected data, whether the robot needs to be corrected; and in response to that the robot needs to be corrected, obtaining a compensation value according to the collected data, and correcting the robot based on the compensation value.

Examples of a substrate treatment apparatus include a plurality of load ports, a front-end module adjacent to the plurality of load ports, a plurality of load lock chambers adjacent to the front-end module, the plurality of load lock chambers include a plurality of wafer housing slots, a wafer handling chamber adjacent to the plurality of load lock chambers, a first wafer transfer device in the front-end module, a second wafer transfer device in the wafer handling chamber, and a controller including a processor and a memory configured to cause the processor to execute a program stored in the memory, or including a dedicated circuitry, to issue a command to a wafer moving device to move a wafer between the plurality of load lock chambers when predetermined wafer transfer conditions are satisfied.

A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.

A component shortage detection device detects a component shortage of a tape feeder installed in a component mounting device. The component shortage detection device includes a sensor, configured to detect the tape, and provided at a position that is a midpoint of a tape transportation path of the tape feeder and upstream of a component extraction position by a component mounting head in a tape transportation direction. The component shortage detection device further includes a residual quantity calculation unit configured to calculate a component residual quantity of the tape during a mounting operation; and a determination unit configured to determine whether a component shortage occurs on a basis of output information from the sensor and the component residual quantity when the head fails in extraction of the component.

A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.

A control apparatus is configured to control an operation of a substrate processing apparatus configured to place at least a monitor substrate therein. The control apparatus controls the operation of the substrate processing apparatus based on a difference between a processing result of the monitor substrate processed by the substrate processing apparatus and a predictive result so as to optimize the monitor substrate loading frequency.

A work management device includes an operator information memory section, a work item memory section, an operator detection sections, and a work instruction section. The operator detection sections are installed at a plurality of spots of the electronic component mounting line and detect the operators near the spots. In a case in which the operator detection section detects the operator, when operator information regarding the operator is identical to operator information in the operator information memory section and the work item group of the work item memory section includes one work item or a plurality of work items which are able to be performed by the operator detected by the operator detection section, the work instruction section instructs the operator detected by the operator detection section in one work item or a plurality of work items selected from the one work item or the plurality of work items.

A deadlock determination method includes constructing a new WRG and determining a deadlock. At least a process step that includes a plurality of resources is selected from process steps in a WRG that supports transporting a single piece of material. The plurality of resources corresponding to the selected process step are combined. A total capacity of each of the process steps is changed according to a combination result to construct the new WRG that supports transporting a plurality of pieces of material. The plurality of resources include apparatuses for performing the process steps. The total capacity is a sum of a number of workstations of resources corresponding to each process step. Determining a deadlock includes determining whether a piece of material scheduling deadlock occurs based on the new WRG. The plurality of resources include apparatuses for performing the process steps.

The present application relates to a wafer transfer module in a semiconductor manufacturing machine, relating to semiconductor integrated circuit manufacturing machines, wherein two sets of transmitter/receivers are provide on sidewalls of the wafer transfer module to monitor the travel position of an elevator, two sets of transmitter/receivers are provide on the sidewalls of the wafer transfer module to monitor the position of a transfer arm, a signal received by the receiver is transmitted to a control system such that the control system determines, according to the travel position of the elevator and the transfer arm position, whether the transfer arm can obtain a to-be-transferred wafer, thereby preventing the problem of a wafer scratch caused by an elevator position deviation or a transfer arm position deviation.

A method includes positioning a robot in a plurality of postures in a substrate processing system relative to a fixed location in the substrate processing system and generating sensor data identifying a fixed location relative to the robot in the plurality of postures. The method further includes determining, based on the sensor data, a plurality of error values corresponding to one or more components of the substrate processing system and causing, based on the plurality of error values, performance of one or more corrective actions associated with the one or more components of the substrate processing system.