A three-dimensional laser machine includes a machine head, a controller for positioning the machine head and controlling an orientation of a nozzle, and a sensor for detecting a distance between a workpiece and the nozzle. The controller is capable of performing a profile control of correcting the position of the machine head based on the detected distance. When the machine head has reached a predetermined position part way through an approach process of moving the machine head from an approach start position to a machining start position while controlling the pose of the nozzle, the controller performs the profile control to move the machine head to the machining start position.

A laser cutting device includes a control unit configured to control operations of a laser machining robot and a laser oscillator. Machining condition tables are stored in memory of the control unit. Each of the machining condition tables includes data of a laser power output and a duty, a usable range of a cutting speed of cutting a workpiece, the usable range being set based on a speed range in which a laser cutting robot can move with given tracking accuracy, and an effective range of the cutting speed and the laser power output that are set so that a cut surface of the workpiece meets given finishing conditions. The control unit is configured to select one of the machining condition tables so that the cutting speed and the laser power output meet given conditions, and control cutting of the workpiece based on the selected machining condition table.

A system and a method for laser marking a graphic on an object. The system includes: a laser system for producing a laser output; element(s) for moving the laser output on a surface of an object; a controller for controlling the laser system and the moving element(s), and for processing control information including a plurality of vectors, where for each vector the controller is configured to set a vector speed and a vector laser power according to a marking intensity value of the corresponding vector group such that at least two vectors within one of the vector groups have with respect to each other different vector speeds and vector laser powers, and a laser output's speed that is set according to the at least two vectors remains different than zero when the laser output travels along two trajectory parts which correspond to the at least two vectors.

The present disclosure provides a wafer repair method, system, apparatus and device, and a storage medium, relating to the field of semiconductor devices. The method includes: a laser equipment acquires test data for repairing a predetermined wafer; the laser equipment sending the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and the laser equipment obtaining the repair data in the predetermined format to repair the predetermined wafer.

Provided is a control device for a laser machining apparatus which can maintain the inclination direction of a nozzle with respect to a machining program route even during modification of the tool diameter correction amount, and which can improve machining accuracy. This control device 1 for a laser machining apparatus comprises: a tool center route calculation unit 12which calculates a tool center route on the basis of an offset vector with respect to a machining program route; a first inclination direction calculation unit 131 which calculates an inclination direction of a nozzle 2 with respect to the machining program route; a tool orientation calculation unit 14 which calculates an orientation of the nozzle 2 on the basis of the inclination direction of the nozzle 2 calculated by the first inclination direction calculation unit 131 and an inclination angle of the nozzle 2 in the inclination direction from a direction that is perpendicular to a plane of a workpiece W in a plane orthogonal to the machining program route; a drive shaft movement amount calculation unit 15 which calculates a movement amount of a drive shaft on the basis of the tool center route and the orientation of the nozzle 2; and a drive shaft control unit 16 which controls the drive shaft on the basis of the movement amount of the drive shaft.

A method for analyzing a laser machining process for machining workpieces includes the steps of acquiring at least one sensor data set for the laser machining process and determining a value of at least one physical property of a machining result of the laser machining process based on the at least one sensor data set using a transfer function. The transfer function is formed by a trained neural network. A system for analyzing a laser machining process and a laser machining system including such a system are also disclosed.

Methods for configuring laser machining machines (1) include control (2), whereby different types laser machining processes (A, B, C, D) can be executed using the laser machine (1), these processes being respectively controlled by the control apparatus (2) using process parameters. The processes of different types are categorized in a classification (20), in which a respective set of process parameters (21A-24A; 21B-24B; 21C-24C; 22D-24D), that are used during the execution of the respective process (A, B, C, D), is assigned to each process. During a determination and/or changing of a first process parameter (21A-24A) of a first process (A), a process parameter (S1-S6; 21B-24B; 21C-24C; 22D-24D) of a different process (B, C, D) that is contained within classification (20), is automatically determined and/or changed according to a stored rule, as a function of the first process parameter.

A method for accessing a computer-numerically-controlled machine can include receiving a command to be executed by the computer-numerically-controlled machine. A hardware state of a component in the computer-numerically-controlled machine can be determined by receiving, from the component, data indicative of the hardware state. An origin of the command including a user identification of a user who sent the command and/or a machine identification of a device that sent the command can be determined. Whether the computer-numerically-controlled machine is allowed to execute the command can be determined by applying a set of rules and based on the hardware state and/or the origin of the command. In response to determining that the computer-numerically-controlled machine is allowed to execute the command, the command can be executed at the computer-numerically-controlled machine.

A method of altering a rate of executing a motion plan by a computer-numerically-controlled machine can include: receiving, at a control unit of a computer-numerically-controlled machine and from a general purpose computer that is housed separately from the computer-numerically-controlled machine, a motion plan defining operations for causing movement of a moveable component of the computer-numerically-controlled machine; and altering, in response to a command received at the computer-numerically-controlled machine, a first execution rate of the operations to a second execution rate of the operations to change a rate of movement of the movable component. Systems and articles of manufacture, including computer program products, are also provided.

A hybrid computer numerical control (CNC) machining center and a machining method thereof are provided. The hybrid CNC machining center has at least a cutting tool head, a laser cladding tool head, a laser surface heat treatment tool head, and a computer numerical control unit. The cutting tool head, the laser cladding tool head, and the laser surface heat treatment tool head are alternately installed in a tool holder of the hybrid CNC machining center. Users can accomplish cutting, laser cladding, and laser surface heat treatment operations for a work-piece just in one single machine, so that the work-piece is unnecessary to be moved between different machines. Therefore, the steps and the process time of the machining operations are substantially simplified.