A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.

A computing card support system, including: a cage positioned on a PCB, including: a first support structure; a second support structure; a cover that is removably coupled to the support structures and positioned opposite to the PCB, the cover including a grounding material positioned along an inner surface of the cover, the inner surface of the cover facing the PCB; computing cards that are i) coupled to the PCB at a first end of each respective computing card and ii) positioned within the cage, each of the computing cards including conductive pads positioned at a second end opposite to the first end of the respective computing card, wherein the computing cards extend from the PCB toward the cover such that the grounding material of the cover is in contact with the conductive pads of each of the computing cards to provide electrical grounding of the computing cards.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

An electronic device is provided. The electronic device includes a flexible panel and a supporting sheet. The flexible panel has a foldable region with a folding axis. The supporting sheet is disposed under the flexible panel. The supporting sheet includes a foldable portion that overlaps the foldable region. The foldable portion includes a plurality of strip parts arranged in a first direction (which is perpendicular to the folding axis) and a plurality of edge parts. Each of the edge parts connects to the ends of at least two of the strip parts. One of the edge parts has a first width in the first direction and a first length in the second direction, which is parallel to the folding axis. The ratio of the first length to the first width is greater than 2.

A housing for an electronic device can include a body having an exterior surface and a second surface disposed opposite the exterior surface at least partially defining an interior volume, the body defining a first repeating pattern of apertures extending from the exterior surface to the second surface. The housing can also include a component defining a second repeating pattern of apertures, the component positioned adjacent to the second surface. The first repeating pattern of apertures and the second repeating pattern of apertures can combine to define an open area of at least about 70%.

A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.

In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.

A number of slots in a chassis of an information handling system and a number of a plurality of sleds to be housed in the chassis may be determined. An airflow for each of the plurality of sleds in each of the plurality of placement configurations may be determined based, at least in part, on the number of slots in the chassis and the number of the plurality of sleds to be housed in the chassis. A recommended placement for each of the sleds may be determined based at least in part on the airflow for each of the plurality of sleds for the plurality of placement configurations. A notification may be generated comprising the recommended placements for each of the plurality of sleds.

An electronic device and method for controlling the electronic device are provided. The electronic device includes a first surface in a first direction, a second surface in a second direction opposite to the first direction, and a third surface enclosing at least a portion of a space formed between the first surface and the second surface. The electronic device also includes an audio module changing an audio signal input to the electronic device into an electronic signal, and a processor being operationally connected to the display and the audio module. The processor is configured to detect the audio signal input via the audio module from a first user via the first surface, detect a touch signal dragged from the third surface in the direction of the second surface, and display in the second surface a translation corresponding to the audio signal.

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.