A foldable screen comprises a plurality of display regions spaced apart in a first direction and one or more foldable regions located between two adjacent ones of the display regions, the foldable screen further comprising a supporting layer and a heat dissipation layer arranged in a stack, where the supporting layer is bendable and is arranged in the display regions and the foldable regions; and the heat dissipation layer is bendable and is arranged in the display regions and the folding regions, and portions of the heat dissipation layer corresponding to the foldable regions are provided with through hole arrays. A display device comprising the foldable screen is further disclosed.

A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component. The nozzle allows liquid coolant to pass the first heat-generating component at a faster rate than the second heat-generating component.

A system for cooling of computing components of an information handling system, including a printed circuit board (PCB); a computing card connector coupled to the PCB, the computing card connector including first mating features; a computing card coupled to the computing card connector; and a thermal plate including a first end and a second end positioned opposite to the first end, the second end including second mating features that correspond to the first mating features of the computing card connector, wherein the thermal plate is coupled to the computing card connector at the second end of the thermal plate such that the second mating features of the thermal plate are mated with the first mating features of the computing card connector.

A portable information handling system modular hybrid architecture separates components between rotationally coupled housing portions to minimize cabling, connectors and materials, and to provide improved durability that supports recycling and reuse of the components. For example, a plurality of housing cover configurations couple to housing portions of different dimensions with opposing couples and a common keystone element that, when installed, prevents separation of the opposing couplers. Removal of the keystone element provides ready access to the housing portion interior to recycle processing components, such as a secondary board having an embedded controller and charger and a battery interfaced with the secondary board.

The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

In example implementations, an electronic device housing is provided. The electronic device housing includes a display housing, a lifting mechanism, abase housing, and a secondary display. The lifting mechanism is coupled to a side of the display housing. The base housing is coupled to the display housing. The secondary display is coupled to a distal side of the base housing. The lifting mechanism is to lift the secondary display on a rotation of the display housing.

An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

An electronic device includes a first housing and a second housing connected to the first housing. An accommodation cavity is formed between the first housing and the second housing. The electronic device further includes a heat generation member arranged in the accommodation cavity and a flow channel arranged in the first housing. The flow channel is configured to accommodate heat exchange liquid and dissipate heat for the heat generation member through the heat exchange liquid.

An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.