An electrical connector includes an insulation housing, a plurality of rows of terminals, and a plurality of corresponding fixing parts. The plurality of rows of terminals are sequentially and fixedly arranged in parallel on the insulation housing. The plurality of fixing parts are assembled to the insulation housing for structurally constraining the corresponding rows of terminals. An electrical connector manufacturing method includes fixing a plurality of first terminals on an insulation housing in a row, assembling a first fixing part to the insulation housing to structurally constrain the row of first terminals, fixing a plurality of second terminals on the insulation housing in a row, assembling a second fixing part to the insulation housing to structurally constrain the row of second terminals, and so on, so as to obtain one like the above electrical connector. The electrical connector can provide data transmission in compliance with PCIe 4.0 standard.

An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.

An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

An apparatus includes a pass-through module that includes connector pins to connect with at least one active portion of a motherboard connector and to separately connect with at least one inactive portion of the motherboard connector. A routing function on the pass-through module redirects a set of bidirectional lanes from the connector pins connected to the active portion of the motherboard connector to the connector pins connected to the inactive portion of the motherboard connector to enable a connection of the set of bidirectional lanes to at least one other motherboard resource connected to the inactive portion of the motherboard connector.

An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

In some examples, a system comprises: a socket; a controller coupled to the socket; a storage device comprising machine-readable instructions; and a processor coupled to the controller and the storage device, wherein execution of the machine-readable instructions causes the processor to: detect a Secure Digital (SD) card in the socket via the controller; prompt a user to select a communication protocol to be utilized by the system to communicate with the SD card; and enable the system to communicate with the SD card based on the user selection.

A Universal Serial Bus (USB) connector functionality modification system includes a USB connector coupled to a first subsystem and a second subsystem by a multiplexer device. A USB connector functionality modification subsystem is coupled to the multiplexer device and operates to receive a USB connector functionality modification instruction while the multiplexer device is configured to allow the first subsystem to transmit and receive data via the USB connector and the second subsystem cannot transmit and receive data via the USB connector. In response to receiving the USB connector functionality modification instruction, the USB connector functionality modification subsystem reconfigures the multiplexer device to allow the second subsystem to transmit and receive data via the USB connector while the first subsystem cannot transmit and receive data via the USB connector.

In accordance with an embodiment, an integrated driver circuit includes: a first connection and a second connection configured to be connected to a control chip; at least one bus connection configured to be connected to a bus line; and a control circuit. The control circuit is configured to operate in a first mode or a second mode; to output a reception signal at the second connection in the second mode, where the reception signal represents a bus signal received at the bus connection; to assume a state of low power consumption in the first mode; to change from the first mode to the second mode when a first command is detected at the first connection or at the second connection; and to change from the second mode to the first mode when the bus signal does not indicate any data for a predefined period of time.

A memory module includes a device memory configured to store data and including a first memory area and a second memory area, and a controller including an accelerator circuit. The controller is configured to control the device memory, transmit a command to exclude the first memory area from the system memory map to a host processor in response to a mode change request, and modify a memory configuration register to exclude the first memory area from the memory configuration register. The accelerator circuit is configured to use the first memory area to perform an acceleration operation.

A semiconductor device with an interface includes a master device and a plurality of slave devices. The master device includes a master interface. The slave devices are stacked on the master device one after one as a three-dimension (3D) stack. Each of the slave devices includes a slave interface and a managing circuit, the master interface and the slave interfaces form the interface for passing signals in communication between the master device and the slave devices. The managing circuit of a current one of the slave devices drives a next one of the slave devices. An operation command received at the current one of the slave devices is just passed to the next one of the slave devices through the interface. A response from the current one of the slave devices is passed back to the master device through the interface.