In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.

Examples described herein provide a computer-implemented method that includes identifying, by a processing device, a victim/aggressor pair of nets for an integrated circuit. The method further includes severing nets of the victim/aggressor pair of nets. The method further includes swapping severed segments of the nets. The method further includes rerouting the nets subsequent to swapping the severed segments of the nets.

A method of constructing an RF filter comprises designing an RF filter that includes a plurality of resonant elements disposed, a plurality of non-resonant elements coupling the resonant elements together to form a stop band having a plurality of transmission zeroes corresponding to respective frequencies of the resonant elements, and a sub-band between the transmission zeroes. The non-resonant elements comprise a variable non-resonant element for selectively introducing a reflection zero within the stop band to create a pass band in the sub-band. The method further comprises changing the order in which the resonant elements are disposed along the signal transmission path to create a plurality of filter solutions, computing a performance parameter for each of the filter solutions, comparing the performance parameters to each other, selecting one of the filter solutions based on the comparison of the computed performance parameters, and constructing the RF filter using the selected filter solution.

A vibration and noise reduction analysis device for a panel part of an automobile is configured to reduce vibration and noise of the panel part caused by vibration from a vibration source and a noise source in the automobile and identify a portion at which a weight of an automotive body of the automobile can be reduced. The vibration and noise reduction analysis device includes: an automotive body model acquisition unit; a sectioned region setting unit; a vibration and noise reduction target panel part model setting unit; a vibration mode/equivalent radiation power peak frequency selection unit; a sectioned region weight change peak frequency acquisition unit; a sectioned region weight contribution degree calculation unit; and a vibration and noise reduction and weight reduction portion identification unit.

A method includes: identifying attributes that are associated with cell edges of abutted cells in a layout of a semiconductor device, wherein the attributes include at least one of terminal types of the cell edges; determining at least one minimal boundary leakage of the abutted cells based on the attributes, for adjustment of the layout of the semiconductor device. A system is also disclosed herein.

The present disclosure provides systems and methods for scalable and parallel computation of hierarchical cascading in finite element method (FEM) simulations of surface acoustic wave (SAW) devices. Different computing units of a cluster or cloud service may be assigned to independently model different core blocks or combinations of core blocks for iterative cascading to generate a model of the SAW devices. Similarly, frequency ranges may independently be assigned to computing units for modeling and analysis of devices, drastically speeding up computation.

Some embodiments provide a method for calculating parasitic parameters for a pattern to be manufactured on an integrated circuit (IC) substrate. The method receives a definition of a wire structure as input. The method rasterizes the wire structure (e.g., produces pixel-based definition of the wire structure) to produce several images. Before rasterizing the wire structure, the method in some embodiments decomposes the wire structure into several components (e.g., several wires, wire segments or wire structure portions), which it then individually rasterizes. The method then uses the images as inputs to a neural network, which then calculates parasitic parameters associated with the wire structure. In some embodiments, the parasitic parameters include unwanted parasitic capacitance effects exerted on the wire structure. Conjunctively, or alternatively, these parameters include unwanted parasitic resistance and/or inductance effects on the wire structure.

A system and method for simulating an electronic circuit is disclosed. The method includes creating a finite set of circuit or device parameter points selected from within an n-dimensional parameter space. The method includes determining, for each circuit or device parameter point of the set, a corresponding response value of the performance metric and a corresponding probability of occurrence. The method includes determining, for a predetermined value of the performance metric, the total probability of occurrence.

The disclosure provides a system to simulate a simulated noise on the power zone block of a substrate. The system comprises a signal trace and a signal generating circuit. The signal trace is disposed adjacent to the power zone block. The signal generating circuit is electrically coupled to the signal trace, configured to transmit an alternating current signal over the signal trace. The alternating current signal transmitted over the signal trace is configured to induce a simulated noise on the power zone block, and a waveform of the simulated noise is determined by a frequency of the alternating current signal.