A data access system including a processor and a storage system including a main memory and a cache module. The cache module includes a FLC controller and a cache. The cache is configured as a FLC to be accessed prior to accessing the main memory. The processor is coupled to levels of cache separate from the FLC. The processor generates, in response to data required by the processor not being in the levels of cache, a physical address corresponding to a physical location in the storage system. The FLC controller generates a virtual address based on the physical address. The virtual address corresponds to a physical location within the FLC or the main memory. The cache module causes, in response to the virtual address not corresponding to the physical location within the FLC, the data required by the processor to be retrieved from the main memory.

A hybrid memory module includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive flash memory. An address buffer on the module maintains a static, random-access memory (SRAM) cache of addresses for data cached in DRAM.

Aspects of the present disclosure relate to asynchronous memory management. In embodiments, an input/output (IO) workload is received at a storage array. Further, one or more read-miss events corresponding to the IO workload are identified. Additionally, at least one of the storage array's cache slots is bound to a track identifier (TID) corresponding to the read-miss events based on one or more of the read-miss events' two-dimensional metrics.

In one embodiment, a controller in a microprocessor, the controller configured to manage accesses to dynamic random access memory (DRAM), the controller comprising: a first table configured to track cache lines that have been written to zero for a plurality of first memory regions; and a second table configured to track the cache lines that have been written to zero for a plurality of second memory regions, wherein each of the plurality of second memory regions comprises a group of the plurality of first memory regions where all of the cache lines within each of the plurality of the first memory regions within the group have been written to zero.

A hybrid memory includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive flash memory. An address buffer on the module maintains a static, random-access memory (SRAM) cache of addresses for data cached in DRAM.

Techniques of memory tiering in computing devices are disclosed herein. One example technique includes retrieving, from a first tier in a first memory, data from a data portion and metadata from a metadata portion of the first tier upon receiving a request to read data corresponding to a system memory section. The method can then include analyzing the data location information to determine whether the first tier currently contains data corresponding to the system memory section in the received request. In response to determining that the first tier currently contains data corresponding to the system memory section in the received request, transmitting the retrieved data from the data portion of the first memory to the processor in response to the received request. Otherwise, the method can include identifying a memory location in the first or second memory that contains data corresponding to the system memory section and retrieving the data from the identified memory location.

Systems, apparatuses, and methods related to three tiered hierarchical memory systems are described herein. A three tiered hierarchical memory system can leverage persistent memory to store data that is generally stored in a non-persistent memory, thereby increasing an amount of storage space allocated to a computing system at a lower cost than approaches that rely solely on non-persistent memory. An example apparatus may include a persistent memory, and one or more non-persistent memories configured to map an address associated with an input/output (I/O) device to an address in logic circuitry prior to the apparatus receiving a request from the I/O device to access data stored in the persistent memory, and map the address associated with the I/O device to an address in a non-persistent memory subsequent to the apparatus receiving the request and accessing the data.

A memory module includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive nonvolatile memory. Local controller manages communication between the DRAM cache and nonvolatile memory to accommodate disparate access granularities, reduce the requisite number of memory transactions, and minimize the flow of data external to nonvolatile memory components.

A storage system includes a CPU, a first memory module, a second memory module, and a storage device. The processor and the first memory module are installed in the same node. The second memory module are replaceable without shutting down power supply of the node. The first memory module stores an operating system and a program for managing user data to be stored in the storage device. The second memory module stores cache data of the user data to be stored in the storage device. The processor is configured to store a copy of data to be stored in the second memory module in the third memory module.

An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.