Aspects of the invention include a computer-implemented method of hierarchical large block synthesis (HLBS). At least a partial ring is created around an HLBS structure. The partial ring includes at least one or more of filler elements, which are engineering change order (ECO) books for adding repeaters to wire dominated nets, and decoupling capacitors of relatively large sizes. Certain areas of the HLBS structure within the partial ring that exhibit a unique characteristic are identified. Decoupling capacitors of the relatively large sizes are disposed in the certain areas. A remainder of the areas of the HLBS structure are filled with engineering change order (ECO) books and decoupling capacitors of relatively small sizes.

Aspects of the invention include a computer-implemented method of hierarchical large block synthesis (HLBS). At least a partial ring is created around an HLBS structure. The partial ring includes at least one or more of filler elements, which are engineering change order (ECO) books for adding repeaters to wire dominated nets, and decoupling capacitors of relatively large sizes. Certain areas of the HLBS structure within the partial ring that exhibit a unique characteristic are identified. Decoupling capacitors of the relatively large sizes are disposed in the certain areas. A remainder of the areas of the HLBS structure are filled with engineering change order (ECO) books and decoupling capacitors of relatively small sizes.

An integrated circuit includes a plurality of standard cells including first and second standard cells arranged adjacent to each other in a first direction, and first, second, and third metal layers sequentially stacked in a vertical direction. At least one power segment is arranged adjacent a region where at least one of the first standard cell and the second standard cell is arranged. The at least one power segment is configured to provide power to the plurality of standard cells and is formed as a pattern of the third metal layer extending in a second direction.

An integrated circuit includes a plurality of standard cells including first and second standard cells arranged adjacent to each other in a first direction, and first, second, and third metal layers sequentially stacked in a vertical direction. At least one power segment is arranged adjacent a region where at least one of the first standard cell and the second standard cell is arranged. The at least one power segment is configured to provide power to the plurality of standard cells and is formed as a pattern of the third metal layer extending in a second direction.

Embodiments include predictive antenna diode insertion. Aspects of the invention include obtaining a design of a macro, the design including an internal pin disposed on a first layer of the macro. Aspects of the invention also include determining a length of a wire needed to connect the internal pin to a furthest edge of the macro for each of two layers above the layer the internal pin. Aspects of the invention further include adding, to the design of the macro, an antenna diode to the internal pin based on the determination that an area of the wire needed exceeds a threshold value, wherein the area of the wire is based on the length and a width of the wire.

Embodiments include predictive antenna diode insertion. Aspects of the invention include obtaining a design of a macro, the design including an internal pin disposed on a first layer of the macro. Aspects of the invention also include determining a length of a wire needed to connect the internal pin to a furthest edge of the macro for each of two layers above the layer the internal pin. Aspects of the invention further include adding, to the design of the macro, an antenna diode to the internal pin based on the determination that an area of the wire needed exceeds a threshold value, wherein the area of the wire is based on the length and a width of the wire.

Provided are embodiments for a computer-implemented method for routing standard cells of an integrated circuit. Embodiments include obtaining a layout of a plurality of standard cells for routing, and determining existing output connections for each of the plurality of standard cells. Embodiments can also include generating a representation for the layout removing the existing output connections for each of the plurality of standard cells; and providing the representation of the layout to an autorouter. Also provided are embodiments for a system and computer program product for routing standard cells of an integrated circuit.

Provided are embodiments for a computer-implemented method for routing standard cells of an integrated circuit. Embodiments include obtaining a layout of a plurality of standard cells for routing, and determining existing output connections for each of the plurality of standard cells. Embodiments can also include generating a representation for the layout removing the existing output connections for each of the plurality of standard cells; and providing the representation of the layout to an autorouter. Also provided are embodiments for a system and computer program product for routing standard cells of an integrated circuit.

Embodiments for tuning parameters to a synthesis program are provided. At least one set of parameter settings for the synthesis program is selected. A plurality of identical synthesis jobs for the at least one set of parameter settings is run in an iteration of the synthesis program. Results of the iteration of the synthesis program are analyzed utilizing a tuning optimization cost function. Combinations of the parameter settings are created based on the analysis. At least one synthesis job for is run each of the combinations of the parameter settings in a subsequent iteration of the synthesis program. The analysis of the results, the creating of the combinations of parameter settings, and the running at the at least one synthesis job for each of the combinations of parameter settings are repeated until an exit criteria has been achieved.

In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.